Elektrolytische abscheidung von gold aus dem sulfitokomplex

Socha, Jan; Safarzyński, Sławomir; Zak, T.

doi:10.1016/0022-5088(75)90148-4

Cited by 8 publications

(4 citation statements)

References 1 publication

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“…At pH Ͼ 9, excess sulfite is entirely in the form of SO 3 2− and it has been reported 32 that, under alkaline conditions, the reduction of SO 3 2− to S 2 O 4 2− cannot be attained. In addition, the reduction potential of the bisulfite ion shifts to more cathodic potentials as the pH is increased 46 so that increased alkalinity will also tend to favor the reduction of Au͑I͒ complex.…”

Section: C158supporting

confidence: 55%

“…However, at lower pHs and high current densities the current efficiencies are found to decrease, indicating an increasing contribution from the former reaction. 11,16,46 The dithionite species is a strong reducing agent and can reduce Au͑SO 3 ͒ 2 3− ͓and therefore A number of studies 10,11,18 have shown that the formation of colloidal gold is observed in the vicinity of the cathode rather than the bulk solution, which offers support for the proposed mechanism.…”

Section: C158mentioning

confidence: 99%

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Speciation Analysis of Au(I) Electroplating Baths Containing Sulfite and Thiosulfate

Green¹,

Roy

2006

J. Electrochem. Soc.

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An analysis of the speciation of gold plating solutions containing sulfite and thiosulfate as complexing agents has been performed. In the case of gold sulfite baths, it was found that the observed stability and electrochemical behavior were inconsistent with the commonly assumed stability constants of ␤ = 10 10 for the Au͑SO 3 ͒ 2 3− species. The data are, however, consistent with a much larger stability constant of ␤ = 10 27 . In gold plating baths containing sulfite and thiosulfate ligands, the speciation model predicts that the dominant species at neutral or basic are mixed complexes of the form Au͑S 2 O 3 ͒͑SO 3 ͒ 3− and Au͑S 2 O 3 ͒͑SO 3 ͒ 2 5− . The thiosulfate complex Au͑S 2 O 3 ͒ 2 3− is only dominant under acidic conditions. It is shown that the electrodeposition characteristics reported in many studies can be interpreted in terms of the existence of such mixed ligand complexes. Finally, the effect of the stability of various gold plating solutions on colloidal gold formation has been explored. For free-standing solutions, decomposition is more likely to occur via the disproportionation of Au͑I͒ species such as AuOH, Au͑OH͒ 2 − , and AuCl 2 − rather than free aurous ions. The stability of gold baths during electrodeposition is mainly influenced by the formation of dithionite ions which reduce Au͑I͒ complexes to form colloidal gold.

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Section: C158supporting

confidence: 55%

Section: C158mentioning

confidence: 99%

Speciation Analysis of Au(I) Electroplating Baths Containing Sulfite and Thiosulfate

Green¹,

Roy

2006

J. Electrochem. Soc.

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“…Electrolyses were carried out galvanostatically applying a constant current ranging from 1 to 2 mA cm -2 in a two-electrode single-compartment cell; a Pt coil facing the cathode was the counterelectrode (anode/cathode surface ratio ≃30). Current density and hydrodynamic conditions were defined according to the Guglielmi codeposition model. − Electrolyses were also carried out under mechanical stirring and an N 2 atmosphere, to inhibit the Au(I) dismutation reaction 1 Composition and Working Conditions of Au Electrodeposition Bath Au (III) as HAuCl 4 4 g L -1 HCO 3 - /CO 3 2- 0.5 M Na 2 SO 3 0.17 M EDTA 0.061 M alkylamine 3.9·10 -3 M As 2 O 3 a 0.12 g L -1 ceramic powders 0.83 g L -1 diamond 0.033−0.1 g L -1 pH 9 temperature 40 °C j 1−2 mA cm -2 a For those baths containing As 2 O 3 . 2 Micrometric and Submicrometric Powders a Used as Hardening Agents samplepowderaverage grain size (μm) A SiC 0.23 B SiC ultrafine 0.04 C Si 3 N 4 0.19 D TiO 2 0.005 E diamond b 0.005 a Powders furnished by CNR laboratories (IRTEC Faenza, TEMPE Milan) and CISE Milan.

…”

Section: Methodsmentioning

confidence: 99%

Characterization of Dispersion-Hardened Electrodeposited Gold Composites. Part 1: SIMS and SEM Study of Powder Inclusions

et al. 2000

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Submicrometric ceramic powders used as hardening agents for electrodeposited gold films were studied. Codeposits were obtained from a CN-free mixed electrolyte with or without the addition of a brightening agent. Secondary ion mass spectrometry (SIMS) and scanning electron microscopy (SEM) were applied to characterize the deposits. SIMS analysis gave useful information about the presence and distributions of additives in the films, and the influence of powders on metal-substrate interdiffusion phenomena were also shown. Surface morphology characteristics depending on experimental conditions, and the presence of additives were evidenced by SEM microscopy. Preliminary hardness tests were also carried out to evaluate the effectiveness of additives as hardening agents.

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“…Current density and hydrodynamic conditions for Au‐powder co‐depositions were defined according to the Guglielmi codeposition model 12–15. Electrolyses were also carried out under mechanical stirring and an atmosphere of N 2 , to inhibit the Au(I) dismutation reaction 16…”

Section: Methodsmentioning

confidence: 99%

Secondary ion mass spectrometric investigation of Au‐based composites

Barison

Piccirillo

Fabrizio

et al. 2001

Rapid Comm Mass Spectrometry

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The electrodeposition of thick gold layers plays an important role both in traditional and high-tech productions, such as jewelry and microelectronics, respectively. In this work a secondary ion mass spectrometric study will be presented on Au co-deposits with (sub-)micrometric ceramic powders, in order to harden gold. Mass spectra are used to identify the components deposited, providing evidence of the additives and/or eventual contaminants introduced during electrolysis. Furthermore, analysis of ion depth profiles and the intensity distribution of ionic species along the film were studied.

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Elektrolytische abscheidung von gold aus dem sulfitokomplex

Cited by 8 publications

References 1 publication

Speciation Analysis of Au(I) Electroplating Baths Containing Sulfite and Thiosulfate

Speciation Analysis of Au(I) Electroplating Baths Containing Sulfite and Thiosulfate

Characterization of Dispersion-Hardened Electrodeposited Gold Composites. Part 1: SIMS and SEM Study of Powder Inclusions

Secondary ion mass spectrometric investigation of Au‐based composites

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