Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries

Casper, Thorben; Gersem, Herbert De; Gillon, Renaud; Götthans, Tomáš; Kron, Tomas; Meuris, Peter; Schöps, Sebastian

doi:10.3850/9783981537079_0776

Cited by 11 publications

(19 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Neglecting aging effects, the uncertain quantities y are modeled to be the relative change of the bond wire lengths. Therefore, we are assuming that the diameter of a wire is precisely controlled by the manufacturing process and a wire's geometry is only subject to an uncertain length l i = l i,0 /(1 − y i ), with a deterministic length l i,0 [2].…”

Section: Simulation Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Determination of bond wire failure probabilities in microelectronic packages

Casper

Schöps²

2016

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Self Cite

View full text Add to dashboard Cite

This work deals with the computation of industry-relevant bond wire failure probabilities in microelectronic packages. Under operating conditions, a package is subject to Joule heating that can lead to electrothermally induced failures. Manufacturing tolerances result, e.g., in uncertain bond wire geometries that often induce very small failure probabilities requiring a high number of Monte Carlo (MC) samples to be computed. Therefore, a hybrid MC sampling scheme that combines the use of an expensive computer model with a cheap surrogate is used. The fraction of surrogate evaluations is maximized using an iterative procedure, yielding accurate results at reduced cost. Moreover, the scheme is non-intrusive, i.e., existing code can be reused. The algorithm is used to compute the failure probability for an example package and the computational savings are assessed by performing a surrogate efficiency study.

show abstract

Section: Simulation Resultsmentioning

confidence: 99%

“…The here used setting for the simulation of the microelectronic chip package has been presented in [2]. In this paper, for simplicity and as shown in Fig.…”

Section: Numerical Settingmentioning

confidence: 99%

Determination of bond wire failure probabilities in microelectronic packages

Casper

Schöps²

2016

2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Self Cite

View full text Add to dashboard Cite

show abstract

“…Again, at early stages, a very simple model could be useful. Lumped inductances with estimated values based on expected lengths of bondwires [3] and leads are added to the testbench. Later, it can be extended with estimates of mutual inductances and capacitances, based on previous designs or simple models.…”

Section: Testbench Model Of the Integrated Circuitmentioning

confidence: 99%

“…2 Ernst-Moritz-Arndt-Universität Greifswald, Greifswald, Germany. 3 NXP Semiconductors, Eindhoven, The Netherlands.…”

Section: Availability Of Data and Materialsmentioning

confidence: 99%

Nanoelectronic COupled Problems Solutions: uncertainty quantification for analysis and optimization of an RFIC interference problem

et al. 2018

View full text Add to dashboard Cite

The FP7 project nanoCOPS (the 7th Framework Programme project Nanoelectronic COupled Problems Solutions) derived new methods for simulation during development of designs of integrated products. It has covered advanced simulation techniques for electromagnetics with feedback couplings to electronic circuits, heat and stress. It was inspired by interest from semiconductor industry and by a simulation tool vendor in electronic design automation.Due to the application of higher frequencies and the continuous down-scaling process, there is a higher probability of unforeseen interactions between different domains of a Radio Frequency Integrated Circuit (RFIC), which can lead to the variability of the output performance functions. Since these undesired phenomena ought to be investigated in the early phases of the integrated circuit (IC) design, in this work we formulate the robust optimization problem in terms of the expectation and the standard deviation values under the uncertainties of material parameters.Therein, the statistical information included in the multi-objective functional can be provided by a response surface model. For this purpose the Stochastic Collocation Method (SCM) combined with Polynomial Chaos Expansion (PCE) has been used. The reason for analyzing the variability of the Electromagnetic Interference (EMI) is, on the one hand, to quantify the uncertainty in an integrated Radio-Frequency Complementary Metal-Oxide Semi-Conductor (RFCMOS) transceiver design, and, on the other hand, to improve this design in a robust sense. We have illustrated our methodology for an integrated Radio-Frequency Complementary Metal-Oxide Semi-Conductor (RFCMOS) transceiver design.

show abstract

“…8 is considered. Here, the same setting as in [19] is chosen. However, only one bonding wire connects one of the contacts to the chip.…”

Section: B Chip Packagementioning

confidence: 99%

Automatic generation of equivalent electrothermal SPICE netlists from 3D electrothermal field models

Casper¹,

Gersem²,

Schöps³

2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

Self Cite

View full text Add to dashboard Cite

Starting from a 3D electrothermal field problem discretized by the Finite Integration Technique, the equivalence to a circuit description is shown by exploiting the analogy to the Modified Nodal Analysis approach. Using this analogy, an algorithm for the automatic generation of a monolithic SPICE netlist is presented. Joule losses from the electrical circuit are included as heat sources in the thermal circuit. The thermal simulation yields nodal temperatures that influence the electrical conductivity. Apart from the used field discretization, this approach applies no further simplifications. An example 3D chip package is used to validate the algorithm.

show abstract

Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries

Cited by 11 publications

References 9 publications

Determination of bond wire failure probabilities in microelectronic packages

Determination of bond wire failure probabilities in microelectronic packages

Nanoelectronic COupled Problems Solutions: uncertainty quantification for analysis and optimization of an RFIC interference problem

Automatic generation of equivalent electrothermal SPICE netlists from 3D electrothermal field models

Contact Info

Product

Resources

About