Electrothermal simulation and design of integrated circuits

Spice-aided modelling of the UC3842 current mode PWM controller with selfheating taken into account

“…There is a method of the separated variables [11,21,22], in which equations describing the device current-voltage characteristics at fixed temperature values and the dependence of the junction temperature at fixed power values are solved alternately. On the other hand, there is also a method of common variables [7][8][9][10][11][12][13][14][15][16][17][18][19][20][23][24][25][26][27], in which these equations are solved simultaneously.…”

“…Although this tool is designed for the isothermal analyses with temperature treated as a fixed value, there are some successful attempts of adapting SPICE to electrothermal analyses, e.g. [8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27].…”

“…Note, that using the method of separate variables, the junction temperature values (in the successive iteration steps) are calculated by other computer programs, e.g. ETS [22], JUMPS [21].…”

Electro-thermal coupling analysis methodology for RF circuits

“…Section 4 presents some considerations about the presented technique and finally conclusions are given in Section 5. [3] or to estimate the circuit performance degradation for low-frequency analog circuits [9]. In RF circuits, electrical signals and thermal signals are at frequencies separated by several orders of magnitude from each other.…”

Microsystem design using simulator coupling

“…In difference to other known simulator couplings [6], [7] the method employed here is based on an automatic time step algorithm. It works with a variable size of the time steps which depends on the convergence of the system equations.…”