Electrothermal properties and modeling of polysilicon microthermal actuators

Geisberger, A.; Sarkar, Niladri; Ellis, M.; Skidmore, George D.

doi:10.1109/jmems.2003.815835

Cited by 132 publications

(95 citation statements)

References 19 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…25 Substituting f = f 1 , and again representing the cantilever properties with those of silicon (C c  730 J/kgK, k c  145 W/mK at 300 K), 26 we find that  = 0.18, placing the operating conditions well away from those where internal heating loss is expected.…”

Section: Appendix B: Analysis Of Thermally-induced Changes In the Funmentioning

confidence: 86%

Research and Development of Non-Spectroscopic MEMS-Based Sensor Arrays for Targeted Gas Detection

Loui¹,

McCall²,

Zumstein³

2012

View full text Add to dashboard Cite

Section: Appendix B: Analysis Of Thermally-induced Changes In the Funmentioning

confidence: 86%

Research and Development of Non-Spectroscopic MEMS-Based Sensor Arrays for Targeted Gas Detection

Loui¹,

McCall²,

Zumstein³

2012

View full text Add to dashboard Cite

“…Finite element analysis (FEA) is a widely reported method in the design of MEMS electrothermal actuators [200], [201], [174], [202], [22], [203]. …”

Section: B22 Numerical Methodsmentioning

confidence: 99%

“…This happens in part because of the temperature dependence of the thermal conductivity of polysilicon [174], which adjusts the phase of the signal in order to reshape the transfer function. This property in Silicon has been used to fabricate temperature sensors based on the thermal diffusivity modulation [175].…”

Section: Figure 47: Comparison Of Simulations To Data Obtained By Tunmentioning

confidence: 99%

“…The change in resistance of the heater introduces nonlinearities to the transfer function of the system. The temperature dependence of the resistor can be modeled as feedback from the thermal domain [195], or using an iterative FEA approach [174]. The electrical power dissipated in the resistor is applied as a heat source in the thermal domain:…”

Section: B1 Electrical Domainmentioning

confidence: 99%

“…A thorough review of methods to model convective heat transfer is also provided in this reference. In both [174] and [212], a temperature dependent convection coefficient is applied to some surfaces to model convection. Heat transfer through the thin air gap between the heater and substrate is modeled as conduction, since in this region the Raleigh number is small.…”

Section: B42 Thermal Boundary Conditionsmentioning

confidence: 99%

See 2 more Smart Citations

Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

View full text Add to dashboard Cite

Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, iv mechanical, and thermal effects. To the best of the author's knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed.The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region.Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An "isothermal electrothermal scanner" is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors.

show abstract

Techniques in MEMS Microthermal Actuators and Their Applications

Geisberger

Sarkar

Mems/Nems

View full text Add to dashboard Cite

Electrothermal properties and modeling of polysilicon microthermal actuators

Cited by 132 publications

References 19 publications

Research and Development of Non-Spectroscopic MEMS-Based Sensor Arrays for Targeted Gas Detection

Research and Development of Non-Spectroscopic MEMS-Based Sensor Arrays for Targeted Gas Detection

Single‐Chip Scanning Probe Microscopes

Techniques in MEMS Microthermal Actuators and Their Applications

Contact Info

Product

Resources

About