Electrothermal dynamics of circuits: analysis and simulations

Storti-Gajani, G.; Brambilla, A.; Premoli, A.

doi:10.1109/81.940190

Cited by 17 publications

(4 citation statements)

References 12 publications

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“…Unfortunately, the simplified description of the switching process of semiconductor devices makes it impossible to model overvoltages and overcurrents occurring in the modelled converter, which increase the value of energy losses in the switching process [72,73]. As a result, the value of the power dissipated in semiconductor devices determined in these programmes is always underestimated [76].…”

Section: Methods Based On Transient Analysismentioning

confidence: 99%

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Methods of Fast Analysis of DC–DC Converters—A Review

Górecki

2021

Electronics

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The paper discusses the methods of fast analysis of DC–DC converters dedicated to computer programmes. Literature methods of such an analysis are presented, which enable determination of the characteristics of the considered converters in the steady state and in the transient states. The simplifications adopted at the stage of developing these methods are discussed, and their influence on the accuracy of computations is indicated. Particular attention is paid to the methods of fast analysis of DC–DC converters, taking into account thermal phenomena in semiconductor devices. The sample results of computations of the DC–DC boost type converter obtained with the use of the selected methods are presented. The scope of application of particular computation methods and their duration times are discussed. Computations were performed with the use of SPICE and PLECS.

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Section: Methods Based On Transient Analysismentioning

confidence: 99%

“…The power lost at the steady state is easy to compute. In turn, the problem of determining losses in semiconductor devices taking into account oscillations (overvoltages and overcurrents) is described, among others, in the papers [72,73].…”

Section: Thermal Phenomena In Power Convertersmentioning

confidence: 99%

Methods of Fast Analysis of DC–DC Converters—A Review

Górecki

2021

Electronics

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“…Hence, a correct dynamic thermal compact model is needed to study such phenomenon. [16][17][18][19][20][21][22] Electrostatic discharge (ESD) is one of the most common electrical over stress failure mechanisms. The latter are responsible for about 40% of failures.…”

Section: Industrial Applications Of Time-dependent Characterizationmentioning

confidence: 99%

Techniques to Create Compact Thermal Models — Dynamic Problems

Lasance

Sabry

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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Many business objectives related to performance, functionality, reliability and safety are affected by temperature. Most reliability protocols at present consider the steady state temperature the only stressor affecting reliability. Consequently, system designers often use temperature reduction as the primary means to improve reliability. However, is the steady state temperature indeed the dominant parameter? There is ample evidence that temperature gradients in space and time are far more important than the absolute temperature (see e.g. Lall et al., 1 Pecht, 2 Parry et al. 3 ). Section 7.2 will discuss a number of application fields for which time-dependent temperature measurements or predictions become increasingly important.Although a growing awareness of the importance of dynamic thermal effects has been lately noticed, the large majority of electronic system designers still believe that time constants of thermal effects are huge compared to those of electronic systems and hence, steady thermal analysis should be sufficient. This last statement is not always true. In fact, as will be proven both qualitatively and quantitatively in this chapter, there is an infinite set of thermal time constants. Some of them are quite comparable to those of electronic phenomena; others are quite larger. Whether or not should one consider dynamic thermal effects, depends on which problem is addressed.This chapter starts with a quick overview of cases where dynamic effects may be important. Then, fundamental aspects of transient modeling will first be introduced for a simple transient one-dimensional problem in order to gain physical understanding about basic notions involved. This will be followed by a well-known application: the structure function. It will then be generalized to fixed profile 3D problems. Next, a review of methods is proposed for constructing Dynamic Compact Thermal Models (DCTM). A general theoretical framework for transient problems with variable profiles will follow based on the same ideas given above for static problems. Some extensions will be briefly addressed in the last section.

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“…Therefore, it is important to model the many physical processes as a whole in order to precisely predict the dynamic response of the solar cell. Traditionally, the thermal process of an electric device is modeled by a separate thermal network, employing the concepts of thermal resistance (due to a finite thermal conductivity) and thermal capacitance (due to heat capacity of the device mass) [1]- [6]. The analogous relationships between electrical and thermal circuits make this easy to do in a standard circuit simulator.…”

Section: Introductionmentioning

confidence: 99%

Dynamic Multi-Physics Model for Solar Array

Liu

Dougal

2002

IEEE Power Eng. Rev.

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Abstract-An approach to model the solar cell system with coupled multiphysics equations (photovoltaic, electro-thermal, direct heating and cooling processes) within the context of the resistivecompanion method in the Virtual Test Bed computational environment is presented. Appropriate across and through variables are defined for the thermal terminal of the system so that temperature is properly represented as a state variable, rather than as a parameter of the system. This allows enforcement of the system power conservation through all terminals, and allows simultaneous solutions for both the electrical potentials and the system temperature. The thermal port built accordingly can be used for natural thermal coupling.The static and dynamic behaviors of the solar array model based on the approach are obtained and validated through comparison of simulation results to theoretical predictions and other reported data. The electro-thermal modeling method developed here can be generally used in the modeling of other devices, and the method to define the across and through variables can also be generalized to any other interdisciplinary processes where natural coupling is required.

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Electrothermal dynamics of circuits: analysis and simulations

Cited by 17 publications

References 12 publications

Methods of Fast Analysis of DC–DC Converters—A Review

Methods of Fast Analysis of DC–DC Converters—A Review

Techniques to Create Compact Thermal Models — Dynamic Problems

Dynamic Multi-Physics Model for Solar Array

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