Abstract:This paper presents a 3D integrated ultra-fast CMOS image sensor (CIS) with on-chip A/D conversions and digital storage.After an analysis of the burst IS structure and power consumption, it appears that the power density is very high (> 0.1 W/mm²) during the burst video acquisition. Therefore, to evaluate the risk of overheating, a study of the thermal dissipation in the 3D stack is described here. This study has been carried out for different operating modes. The thermal simulations show that in single burst … Show more
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