Electroplating of Semiconductor Materials for Applications in Large Area Electronics: A Review

Abstract

The attributes of electroplating as a low-cost, simple, scalable, and manufacturable semiconductor deposition technique for the fabrication of large-area and nanotechnology-based device applications are discussed. These strengths of electrodeposition are buttressed experimentally using techniques such as X-ray diffraction, ultraviolet-visible spectroscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, and photoelectrochemical cell studies. Based on the results of structural, morphological, compositional, optical, and electronic properties evaluated, it is evident that electroplating possesses the capabilities of producing high-quality semiconductors usable for producing excellent devices. In this paper we will describe the progress of electroplating techniques mainly for the deposition of semiconductor thin film materials and their treatment processes, and fabrication of solar cells.

Lateral Growth of MoS2 2D Material Semiconductors Over an Insulator Via Electrodeposition

“…[ 12 ] Electrodeposition is not a line‐of‐sight deposition method as material growth occurs at electrical contacts and is controlled by electrical potential or current. [ 13 ] It can hence be utilized to deposit materials over 3D surfaces including patterned nanostructures of high aspect ratios. [ 14–17 ] In addition, electrodeposition is usually performed at room temperature, avoiding harsh environments such as plasma or extremely high temperatures, which can damage pre‐existing materials on the substrate, such as graphene electrodes.…”

Copper Nitride Nanowire Arrays—Comparison of Synthetic Approaches

“…Two types of copper surfaces were investigated and compared: copper films deposited by the thermal evaporation (PVD method) and films obtained by electroplating. The electroplating method is a simple, low-cost process [ 42 , 43 , 44 ], while the PVD technique allows for the production of homogeneous metallic coatings with excellent adhesion [ 45 ]. The combination of both methods with the chemical growth of nanostructures and ammonolysis were tested to fabricate more topographically varied, three-dimensionally structured Cu 3 N films, that are impossible to obtain via the usually utilized magnetron sputtering method.…”

Inkjet-Printed Electronics on Paper for RF Identification (RFID) and Sensing

“…The advantages of paper for electronics can be further enhanced in light of the large-area printed electronics fabrication process [16][17][18][19][20][21]. For example, an additive process such as inkjet printing technology does not produce any by-products, for example, strong acids (wet etching) or chips (milling machines) [22][23][24][25][26][27][28][29].…”