2001
DOI: 10.1111/j.1151-2916.2001.tb00658.x
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Electrophoretic Deposition of Zirconia on Porous Anodic Substrates

Abstract: The aim of the present work is the preparation of thin (<20 m) zirconia layers on porous substrates with the electrophoretic deposition process. The preparation was completed with a cosintering step of substrate and layer. Through adjustment of shrinkage and the shrinkage rate of the deposited zirconia layer on the presintered porous substrate, thin, dense layers without cracks were prepared. A method for direct control of the layer thickness during the electrophoretic deposition process was developed. The sol… Show more

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Cited by 79 publications
(59 citation statements)
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“…However, EPD is still not a widespread method for deposition of dense electrolyte films for SOFCs, even though it has been already used for deposition of oxygen ion conductor electrolytes on anode or cathode porous substrates [14][15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…However, EPD is still not a widespread method for deposition of dense electrolyte films for SOFCs, even though it has been already used for deposition of oxygen ion conductor electrolytes on anode or cathode porous substrates [14][15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%
“…The different components should be prepared in such a way that the total shrinkage of the components match each other. A mismatch in the shrinkage would produce stress which can lead to cracking of the electrolyte film during the cosintering process [10,22,28]. As already mentioned in the introduction, the linear shrinkage of the anode-support also affects the densification of the electrolyte film [17,19,22,29].…”
Section: Sintering Characteristics Of 8ysz Electrolyte and Nio-ysz Anodementioning
confidence: 95%
“…In general by careful adjustment of the chemistry of the suspension by using additives [11,12,27], by a judicious choice of solvents [26] or by humidity control [14] cracking during drying can be avoided. A common practice to avoid cracking during co-sintering is by using substrates that shrink together with the coating [10,22,26,28]. Substrate shrinkage during cosintering is also reported to aid the densification of the coating [17,19,22,29].…”
Section: Introductionmentioning
confidence: 95%
“…i n t e r n a t i o n a l j o u r n a l o f h y d r o g e n e n e r g y 3 7 ( 2 0 1 2 ) 1 9 0 4 5 e1 9 0 5 4 process, the YSZ concentration in the suspension decreases with the deposition time [24]; secondly, the geometrical distance between the electrodes in the EPD bath decreases due to growth of the YSZ film on the substrate. The formation of this layer would change the electric field strength due to nonconductive nature of YSZ particles (the shield effects) [37]; and thirdly, by growing a dense YSZ film over the substrate, the hydrodynamic drag forces exerted on the particles are reduced due to the change in the amount of flow in the substrate pores [26].…”
Section: Investigation Of Epd Processing Parametersmentioning
confidence: 96%