2015
DOI: 10.1007/s11665-015-1834-1
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Electrophoretic Deposition of Cu-SiO2 Coatings by DC and Pulsed DC for Enhanced Surface-Mechanical Properties

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Cited by 12 publications
(8 citation statements)
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“…Anodising peak current vs. applied pulse frequency for AA1050.The observations presented above reveal that the anodising kinetics and the optical appearance are improved when moving from direct current anodising to high frequency pulse anodising mode. This is in close resemblance to the observations that are made for electrodeposition of certain metals where it is well documented that pulse electrodeposition is associated with advantages such as significant improvement in surface properties, higher deposition rates, reduction in porosity, better corrosion resistance, less porosity, reduced grain size and lower surface roughness[79] [80]. Maharana et al[80] concludes that surface roughness decreases during increasing frequency upon electrodeposition of Cu-SiO2 coatings.…”
supporting
confidence: 72%
See 1 more Smart Citation
“…Anodising peak current vs. applied pulse frequency for AA1050.The observations presented above reveal that the anodising kinetics and the optical appearance are improved when moving from direct current anodising to high frequency pulse anodising mode. This is in close resemblance to the observations that are made for electrodeposition of certain metals where it is well documented that pulse electrodeposition is associated with advantages such as significant improvement in surface properties, higher deposition rates, reduction in porosity, better corrosion resistance, less porosity, reduced grain size and lower surface roughness[79] [80]. Maharana et al[80] concludes that surface roughness decreases during increasing frequency upon electrodeposition of Cu-SiO2 coatings.…”
supporting
confidence: 72%
“…This is in close resemblance to the observations that are made for electrodeposition of certain metals where it is well documented that pulse electrodeposition is associated with advantages such as significant improvement in surface properties, higher deposition rates, reduction in porosity, better corrosion resistance, less porosity, reduced grain size and lower surface roughness[79] [80]. Maharana et al[80] concludes that surface roughness decreases during increasing frequency upon electrodeposition of Cu-SiO2 coatings. This is explained by a greater number of nucleation sites upon using pulse mode compared to direct current, which in turn leads to a smoother film with a lower Ra value.…”
supporting
confidence: 72%
“…The decrement in WC co-deposition in the case of 7 g l −1 WC added coating could be accredited to the concentration saturation. This means that a minor decrease in WC co-deposition beyond 5 g l −1 can be ascribed to the accumulation of the WC particles in the electrolyte during the deposition [25,26].…”
Section: Composition and Microstructural Analysismentioning
confidence: 99%
“…The advantages of electrodeposition is an excellent low cost and low temperature technique compared to the conventional methods such as powder metallurgy, sputtering, spin coating, thermal spraying, centrifugal casting etc., which is used to coat over the complicated conductive surfaces. Electrodeposition is an industrially viable and economically preferable technique for the deposition of metals and alloys and metal matrix nanocomposites (MMNCs) [23][24][25][26][27][28][29][30][31][32]. The SiCnanoparticlesare very hard materials and possess high strength and high thermal conductivity, good corrosion and wear resistance and low cost material.…”
Section: Introductionmentioning
confidence: 99%