Electrooxidation of the hypophosphite ion on a palladium electrode

Khaldeev, G. V.; Петухов, И. В.; Shcherban, M. G.

doi:10.1007/bf02757504

Cited by 12 publications

(13 citation statements)

References 5 publications

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“…ENP can be, in principle, split into the cathodic reaction (Ni‐P deposition), and the anodic reaction H 2 PO

_{2}^{−}

+ H 2 O → H 2 PO

_{3}^{−}

+ 2H + + 2e − . The anodic half reaction is deemed to be the rate determining step of the whole ENP 22–25. Hence, the Bi 3+ ‐complex ion is expected to retard the anodic reaction when its concentration is above C Bi‐C .…”

Section: Resultsmentioning

confidence: 99%

“…−0.41V vs. Ag/AgCl) reflects oxidation of hypophosphite ion, and the second one (ca. −0.14V) the dissolving of Ni‐P layer 23–28. As plating rate of cathodic reaction is governed by the anodic current density or the supply of electrons from anodic reaction, the peak intensity that reflects the oxidation rate of hypophosphite ion could, therefore, be taken as a measure of ENP rate at a particular concentration of stabilizer.…”

Section: Resultsmentioning

confidence: 99%

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The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

Wang

Hong

2009

AIChE Journal

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Bi 3þ -complex ion is presented here as a less toxic stabilizer for use in electroless nickel plating (ENP) to replace the existing Pb 2þ ion stabilizer. The asymmetric derivatives of EDTA are identified to be a type of coordination ligands that can combine with Bi 3þ ions to form soluble complexes in the acidic ENP solution. In the ENP system studied the Bi 3þ -complex ion displays a critical stabilizer concentration of about 10 À5 mol/L, that is, the percolation concentration over which the ENP rate drops sharply. Besides the experimental measurement, deposition rates of both Ni and P are also simulated by using a kinetic model that has been derived from the double electric layer theory. The Bi 3þ -complex ion, behaving like conventional Pb 2þ ion, stabilizes ENP bath through the chemical replacement reaction at the surface of Ni deposition layer and results in a passive plating surface. This investigation also verifies the properties of the EN deposit, which are insignificantly affected by the length of service time of the plating solution by employing Bi 3þ -complex ion stabilizer.

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“…ENP can be, in principle, split into the cathodic reaction (Ni‐P deposition), and the anodic reaction H 2 PO

_{2}^{−}

+ H 2 O → H 2 PO

_{3}^{−}

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

Wang

Hong

2009

AIChE Journal

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“…Laboratory results used to be accompanied by Monte Carlo simulations, a natural bond orbital analysis, and that by the density functional theory (DFT) method . According to Khaldeev et al , oxidation of sodium hypophosphite on a palladium electrode, depending on pH of the solution, can be depicted by reactions and .…”

Section: Literature Hypotheses Of the Ni‐p Coating Deposition Mechanismmentioning

confidence: 99%

Summary of Existing Models of the Ni‐P Coating Electroless Deposition Process

Stankiewicz

Szczygieł

2013

Int J of Chemical Kinetics

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Electroless nickel‐phosphorous plating is a technique often employed in preparation of protective, decorative, and functional coatings. Several feasible mechanisms are discussed in the literature. The influence of process parameters on metal coating deposition is analyzed and described. Nevertheless, some basics of the process and the fundamental aspects of plating still not explained. A number of research groups make an effort to provide a description of the process with a physical model. The aim is to design a theoretical model that could be valid under operating conditions on a practical scale. This work gives a short review of the published data on the mechanism and kinetics of the electroless Ni‐P deposition process. The review also touches a novel approach—proposition to analyze data using artificial intelligence tools.

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“…RESULTS AND DISCUSSION The current electrochemical viewpoint is that the anodic oxidation of the hypophosphite ion proceeds via a dissociative chemisorption mechanism, whose limiting stage is the cleavage of the P-H bond in [10][11][12] ·HP + H ads ,…”

Section: Catalytic Activity Of Nickel Alloys In Anodic Oxidation Of Tmentioning

confidence: 99%

Catalytic Activity of Nickel Alloys in Anodic Oxidation of the Hypophosphite Ion as a Function of Their Composition

2005

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The rate of anodic oxidation of the hypophosphite ion on alloys Ni-P, Ni-B, and Ni-Mo-P is studied as a function of their composition and structure. The organic compounds that are customarily used to stabilize electrolytes of electroless nickel plating are shown to come useful when controlling composition of the Ni-P coatings at the expense of their different influence on the rates of partial processes of deposition of the alloy components. The formation of catalytic activity of such coatings is affected mostly by a structural factor. With alloys Ni-P, Ni-B, and Ni-Mo-P, whose composition was varied by altering the concentration of the source of the alloying component, dependence of catalytic activity of the surface on the composition is defined mainly by an electronic factor.

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Electrooxidation of the hypophosphite ion on a palladium electrode

Cited by 12 publications

References 5 publications

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

Summary of Existing Models of the Ni‐P Coating Electroless Deposition Process

Catalytic Activity of Nickel Alloys in Anodic Oxidation of the Hypophosphite Ion as a Function of Their Composition

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Electrooxidation of the hypophosphite ion on a palladium electrode

Cited by 12 publications

References 5 publications

The role of Bi3+‐complex ion as the stabilizer in electroless nickel plating process

The role of Bi3+‐complex ion as the stabilizer in electroless nickel plating process

Summary of Existing Models of the Ni‐P Coating Electroless Deposition Process

Catalytic Activity of Nickel Alloys in Anodic Oxidation of the Hypophosphite Ion as a Function of Their Composition

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The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process