2003
DOI: 10.1016/s0168-583x(02)02028-1
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Electronic thermal spike effects in intermixing of bilayers induced by swift heavy ions

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Cited by 59 publications
(29 citation statements)
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“…It may be noted that the increase in temperature in localised region around the ion path in Si is smaller than that in Fe as predicted by thermal spike model. Such a possibility is shown theoretically 32 in Ni/Ti bilayer system, in agreement with experimental results.…”
Section: Ion Beam Mixingsupporting
confidence: 87%
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“…It may be noted that the increase in temperature in localised region around the ion path in Si is smaller than that in Fe as predicted by thermal spike model. Such a possibility is shown theoretically 32 in Ni/Ti bilayer system, in agreement with experimental results.…”
Section: Ion Beam Mixingsupporting
confidence: 87%
“…However it was observed that the IBM takes place, even if, the S e threshold is overcome in one of the two materials at the interface like in Fe/Si, where it is known that track creation does not take place in Si, even by GeV energy of monoatomic ion and the track creation occurs in the Fe beyond certain threshold of Se. IBM in such a case is explained 32 on the basis that although bulk Si does not go to molten state, still a thin layer of Si at the interface melts transiently because its melting point is lower than that of Fe and the thermal energy transfer takes place from the Fe layer to adjacent Si, which is at lower temperature. This is shown by a schematic in Fig.…”
Section: Ion Beam Mixingmentioning
confidence: 99%
“…This causes an increment in the lattice temperature that can exceed the melting temperature. Therefore, if one of the components is sensitive to the electronic energy loss, the melting phase will appear at the interface of bi-layers system and the mixing between two different materials could occur due to the high diffusivity of components in a liquid phase [48][49][50]. Consequently, one can suppose that intermixing could be attributed to interdiffusion in the molten ion track, provided that, at least one of the components is sensitive to S e deposition.…”
Section: Mixing With Metallic Materialsmentioning
confidence: 99%
“…Similarly, S n is estimated to be 1.04 keV/nm for W and 0.6 keV/nm for Fe [33]. The effective mechanism of electronic energy loss in metals is through the thermal spike [22,[34][35][36]. Recently Gupta et al [37] have reported computer simulation of temperature rise of a thermal spike generated with 120 MeV Au 9 + ions in bulk Fe.…”
Section: Discussionmentioning
confidence: 99%