2016
DOI: 10.1021/acsami.6b10813
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Electronic Structure and Band Gap of Fullerenes on Tungsten Surfaces: Transition from a Semiconductor to a Metal Triggered by Annealing

Abstract: The understanding and control of molecule-metal interfaces is critical to the performance of molecular electronics and photovoltaics devices. We present a study of the interface between C and W, which is a carbide-forming transition metal. The complex solid-state reaction at the interface can be exploited to adjust the electronic properties of the molecule layer. Scanning tunneling microscopy/spectroscopy measurements demonstrate the progression of this reaction from wide band gap (>2.5 eV) to metallic molecul… Show more

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Cited by 5 publications
(1 citation statement)
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“… 68 In the reaction between the surfaces of C 60 and tungsten (W), the bond gap can be controlled by selecting the annealing temperature. 69 These are just some example of the bond gap engineering. A selective substrate for adsorption of gases or vapors can be achieved by bond gap engineering in gas adsorbents combined with modified fullerene.…”
Section: Resultsmentioning
confidence: 99%
“… 68 In the reaction between the surfaces of C 60 and tungsten (W), the bond gap can be controlled by selecting the annealing temperature. 69 These are just some example of the bond gap engineering. A selective substrate for adsorption of gases or vapors can be achieved by bond gap engineering in gas adsorbents combined with modified fullerene.…”
Section: Resultsmentioning
confidence: 99%