Electronic Speckle Pattern Interferometry Applied to the Displacement Measurement of Sandwich Plates with Single ‘Fully Potted’ Insert

Huang, Song–Jeng; Lin, Hwa-Long

doi:10.1017/s172771910000349x

Cited by 5 publications

(3 citation statements)

References 8 publications

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“…3 is observed by this interferometer. Unlike the electronic speckle pattern interferometry (ESPI) [11], the surface of measurement was required be specular during the test, so that the specimen surface had to be replicated with a mirror-like gold foil by a thin (less than one mil.) layer adhesive.…”

Section: Twyman-green Interferometrymentioning

confidence: 99%

Hygrothermal Effect on Deformations of QFN Electronic Packaging

Tsai¹,

Huang²,

Huang³

2006

J. mech.

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The hygrothermal-mechanical behavior of a quad flat non-lead (QFN) package without a chip inside is investigated experimentally and numerically. The present study is focused on understanding the effect of the inherent hygrothermal behaviors of epoxy molding compound (EMC) on the deformations of QFN package. Prior to studying the package, the coefficient of moisture expansion for the EMC is measured experimentally. Full-field moiré and Twyman-Green interferometries are used for measuring the real-time in-plane and out-of-plane deformations of the specimen, respectively, under thermal and moisture loading. In addition, the finite element and theoretical analyses are adopted for validating the experimental observations and further understanding the hygrothermal mechanics of the specimen. The coefficient of moisture expansion of the EMC was experimentally obtained to be about 0.2. The experimental results of the full-field deformations of the specimen, due to temperature, moisture and a combination of both, are presented. The experimental observations are validated by the finite element and theoretical analyses. It was observed that the maximum moisture-induced deformation (strain) can be up to as large as 50% of the thermal deformation (strain) caused by AT = 50°C for the specimen. As a result, neglecting moisture-induced deformations (strains) would cause the significant amount of error in thermal deformation (strain) measurement of plastic packages. Furthermore, the present study has laid down the fundamental mechanics and approaches for the QFN packaging structural design and analysis in terms of hygrothermal effects.

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Section: Twyman-green Interferometrymentioning

confidence: 99%

Hygrothermal Effect on Deformations of QFN Electronic Packaging

Tsai¹,

Huang²,

Huang³

2006

J. mech.

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“…Huang et al. [16] measured accurate out‐of‐plane surface displacement of loaded sandwich panels with a single fully potted insert by using ESPI. To the authors’ knowledge, there exist surprisingly few reports on DPSS measurement of sandwich panels with insert.…”

Section: Introductionmentioning

confidence: 99%

Slope of the Out‐of‐Plane Deflection Measurement of Composite Sandwich Plate With a Fully Potted Insert by Using Digital Phase‐Shifting Shearography

Huang

Liu

2011

Strain

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A digital shearographic (DS) technique is a tool well‐suited for precision strain measurement and is a non‐destructive testing technology. But the fringe patterns of DS have not so high sensitivity due to the limitation of CCD camera resolution. Therefore a phase‐shifting technique is incorporated into DS and demonstrated to yield fringe patterns with good quality. The main purpose of this study is to set‐up a measuring system of digital phase‐shifting shearography (DPSS) to measure slope of the out‐of‐plane deflection of sandwich plate with a fully potted insert. The present system includes piezoelectric transducer, servo controller, Michelson shearing mechanism, image processing system and loading system. The four‐step phase shifting method is used to obtain phase map and then the phase expansion is proceeded by Macy algorithm to obtain the slope of the out‐of‐plane deflection of honeycomb sandwich plate with insert/potting material. Finally, comparing the slope of the out‐of‐plane deflection of DPSS with that of DS shows 2 to 7% difference of slope of deflection exhibiting.

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“…Hung [9] conducted experimental investigation using DS to obtain strain measurement, material characterisation, residual stress evaluation, vibration studies and 3‐D shape measurement of composite structures. Huang and Lin [10] measured accurate out‐out‐plane surface displacement of loaded sandwich panels with single fully potted insert by using ESPI. To the authors’ knowledge, there exist surprisingly few reports on DS strain measurement for sandwich panels with insert.…”

Section: Introductionmentioning

confidence: 99%

Out‐of‐Plane Strain Measurement in Sandwich Plates with Single Fully Potted Insert by using Digital Shearography

Huang

Lin

2007

Strain

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The construction and operation of digital shearography (DS) applied to sandwich plates with a single fully potted insert have been presented. The proposed DS has the advantage of full‐field and non‐destructive testing, that can measure tiny out‐of‐plane strain in the elastic region without wasting specimen. For validation purposes, analytical solution analysis (ASA) stemming from our previous study [S. J. Huang, L. W. Chiu, M. T. Kao (2004) Structural Analysis of Sandwich Plates with Inserts – Five Layers Theory, Proc. 2004 AASRC/CCAS Joint Conf.] was conducted. By comparing the results of DS and ASA strain fields throughout the sandwich surface a convincing agreement is revealed, thus successfully showing the full‐field strain measurement of the single fully inserted sandwich plates using DS.

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Electronic Speckle Pattern Interferometry Applied to the Displacement Measurement of Sandwich Plates with Single ‘Fully Potted’ Insert

Cited by 5 publications

References 8 publications

Hygrothermal Effect on Deformations of QFN Electronic Packaging

Hygrothermal Effect on Deformations of QFN Electronic Packaging

Slope of the Out‐of‐Plane Deflection Measurement of Composite Sandwich Plate With a Fully Potted Insert by Using Digital Phase‐Shifting Shearography

Out‐of‐Plane Strain Measurement in Sandwich Plates with Single Fully Potted Insert by using Digital Shearography

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