Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)
DOI: 10.1109/emap.2001.983947
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Electronic reliability engineering in the 21st century

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Cited by 7 publications
(10 citation statements)
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“…The second class includes physical deterioration (i.e., wearout [63]) and external interference through physical phenomena (e.g., lightning stroke). Early and premature wearout failures are caused by the displacement of the mean and variability due to manufacturing, assembly, handling, and misapplication [64].…”
Section: Hardware Fault Modelmentioning
confidence: 99%
“…The second class includes physical deterioration (i.e., wearout [63]) and external interference through physical phenomena (e.g., lightning stroke). Early and premature wearout failures are caused by the displacement of the mean and variability due to manufacturing, assembly, handling, and misapplication [64].…”
Section: Hardware Fault Modelmentioning
confidence: 99%
“…In contrast to wearout failures that affect the entire population, infant mortality failures tend to affect only a subpopulation of the shipped product [21]. The reliability curve visualizes that the average failure rate of an ECU in the useful life period is very high.…”
Section: Assumptions Behind the Fault Modelmentioning
confidence: 99%
“…The bathtub curve is divided into three distinct phases, the infant mortality, the useful life, and the wearout phase. According to [21] infant mortality failures are typically due to mistakes made during the manufacturing process. Thus, improved manufacturing can significantly reduce the incidence of such failures (i.e.…”
Section: Assumptions Behind the Fault Modelmentioning
confidence: 99%
“…researchers that any reliability model should reflect device fabrication technology, geometries, and materials. Notice changed was observed where editions C, D, E and F of this handbook were published in 1979,1982,1986 and 1995 respectively [10].…”
Section: Literature Reviewmentioning
confidence: 99%
“…Pecht [10] suggested abandoning the usage of the MIL-HDBK-217 after reviewing the development history of the reliability quantification methods, the advances in technology, and the drawbacks of these methods. His conclusion may be overstated, but he point out some problems embedded in these methods.…”
Section: Literature Reviewmentioning
confidence: 99%