Electronic packaging solder joint reliablity assessment with a mechanics-based StrainGage methodology

Mercado, L.L.; Hsieh, G.; Girouard, S.

doi:10.1109/tcapt.2005.848583

Cited by 14 publications

(3 citation statements)

References 3 publications

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“…Strain gauges have been widely used in measuring the mechanical strain on a PCB due to their reliable and easy-to-use characteristics. Appropriately selected locations adhered with a strain gauge are very important for accurately measuring the strains on packages [4]. A method for evaluating the strain gauges used in printed circuit board assemblies was proposed for mechanical strain monitoring [5].…”

Section: Introductionmentioning

confidence: 99%

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

et al. 2017

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Abstract:Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and a PCB with dual in-line memory module (DIMM) sockets during solder reflow heating, while the finite element method (FEM) is used to analyze the thermally-induced deformation of the PCB specimen for ensuring the validity of the measurement. Conventional strain gauges are employed to measure the strains (albeit as in-plane strain data) in both specimens during the solder reflow process. The results indicate that the strain gauge-measured strain data from the top and bottom surfaces of both specimens during the solder reflow can be converted into curvature data with specific equations, and even into global out-of-plane deformations or warpages with a proposed simple beam model. Such results are also consistent with those from the shadow moiré and FEM. Therefore, it has been proved that the strain gauge measurement associated with the simple beam model can provide a method for the real-time monitoring of PCB deformations or warpages with different temperatures during the solder reflow process.

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Section: Introductionmentioning

confidence: 99%

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

et al. 2017

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“…Once the boards were properly assembled and mounted using daisy-chain connections, they were inspected using transmission X-ray to detect any failure in the boards prior to the bend test. This is an important step since a change in resistance can result from a failure in the board due to manufacturing process [2].…”

Section: Sample Descriptionmentioning

confidence: 99%

Fiber Bragg Grating Sensors for Failure Detection of Flip Chip Ball Grid Array in Four-Point Bend Tests

Hussain

Zhou

et al. 2009

IEEE Sensors J.

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We have successfully demonstrated the application of fiber Bragg grating sensors to detect the solder interconnect debounding between flip chip ball grid array and printed circuit board in four-point bend tests. Four sensors, due to their small size, are surface-mounted on the four-corners of the ball grid array substrate, about 1 mm from the solder balls that allow more sensitive strain measurement under board flexure. The measured strain data are compared with the data from strain gauge, daisy chain resistance, and dye and pry test. The preliminary results show that the fiber sensors are capable of detecting the onset of solder joint fracture, strain relaxation, and extent of the failure.Index Terms-Fiber Bragg grating sensor, four-point bending test, strain detection.

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“…(2002) report the fatigue life for various types of packaging, whereby cyclic bending testing is used to identify the failure of solder joints and is characterized by the Weibull model, combined with experimental testing. To obtain valuable information in experimental testing, strain gage rosettes have been widely used in the industry to match the stresses in mechanical bending testing (Mercado et al ., 2006; Rooney et al ., 2004). The finite element analyses have been used to evaluate the solder joint fatigue life in a surface mount assembly.…”

Section: Introductionmentioning

confidence: 99%

Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment

Lan

2017

SSMT

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Purpose The purpose of this study was to investigate the changes in solder joint stress when subjected to mechanical bending. The analytical theory pertaining to the stresses in the solder joint between the components (including the molding compound, the chip and the substrate) was described, and the printed circuit board (PCB) with a discontinuity function when the PCB assembly is subjected to mechanical bending was developed. Thus, the findings reported here may lead to a better understanding of the solder joint failure based on the Physics of Failure model. Design/methodology/approach This paper discusses the analytical model for calculating the stress in solder joints, as well as presents a simulation model that can be used for calculating the strain energy density of solder joint. First, the multilayer plate theory is used in discussing the composite material for the component, including the molding compound, the silicon chip and the substrate, or the PCB, including the copper layers, the fiber and the epoxy. Finally, the complete structure of the analytical model developed as a part of this current work is presented. Findings For the analytical model of multilayer structures in which the interconnection layer is discrete, mechanical bending has been modeled with respect to varying silicon chip length. The analytical model that describes the stress of the outermost solder joint experiences is chosen, as this is the typical solder joint failure. The analytical model can be applied to discrete solder joints, which are evaluated by calculating the matrix form. Owing to its use of the matrix equation, the analytical model can be highly combinatorial and thus more capable of calculating the solution. Research limitations/implications The analytical solution based on a simple concept was presented and validated using the finite element model for the stress experienced by solder joints subjected to mechanical bending. To verify that the simulation represents a real PCB case, the authors use the finite element method (FEM) to compare their case with the multilayer plate theory. Owing to the good agreement between the theory and simulation results, the authors conclude that the multilayer plate theory can be correctly applied in multilayer PCB and be used in an analytical model for the PCB assembly subjected to mechanical bending. Practical implications Owing to the good agreement between the theory and simulation results, the authors conclude that the multilayer plate theory can be correctly applied in multilayer PCB and be used in an analytical model for the PCB assembly subjected to mechanical bending. Social implications The analytical model is validated with the FEM model and provides the way to physically examine the solder joint failure mechanism. In this paper, the analytical model is developed as a means to assess the solder joint stress subjected to mechanical bending. Originality/value The analytical model treats the solder joint as discrete and has been successfully validated against the finite element model. The complete structure model (the second analytical model) is presented to discuss the effects of varying silicon chip length on the normal stress in solder joints. When the silicon chip length exceeds to 80 per cent of the total package length, the stress of the outermost solder joint increases rapidly. The design analysis findings have suggested that the failure of the outermost solder joint subjected to mechanical bending on the PCB assembly can be reduced by analyzing the analytical model.

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Electronic packaging solder joint reliablity assessment with a mechanics-based StrainGage methodology

Cited by 14 publications

References 3 publications

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

Fiber Bragg Grating Sensors for Failure Detection of Flip Chip Ball Grid Array in Four-Point Bend Tests

Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment

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