2004
DOI: 10.1016/j.mseb.2003.07.001
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Electron microscopy characterization of a molybdenum diffusion barrier in metallizations for chip carriers

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Cited by 3 publications
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“…There are many candidate materials for a diffusion barrier other than Zr and V. Refractory metals such as Nb, Mo and Ta have been widely used as diffusion barrier materials [16][17][18]. In this study, the diffusion barrier performances of various metallic layers were compared by out-of-pile diffusion couple tests.…”
Section: Introductionmentioning
confidence: 99%
“…There are many candidate materials for a diffusion barrier other than Zr and V. Refractory metals such as Nb, Mo and Ta have been widely used as diffusion barrier materials [16][17][18]. In this study, the diffusion barrier performances of various metallic layers were compared by out-of-pile diffusion couple tests.…”
Section: Introductionmentioning
confidence: 99%