Articles you may be interested inEffect of substrate bias and oxygen partial pressure on properties of RF magnetron sputtered HfO2 thin films J. Vac. Sci. Technol. B 32, 03D104 (2014); 10.1116/1.4825234 Electrical characterization of atomic-layer-deposited hafnium oxide films from hafnium tetrakis(dimethylamide) and water/ozone: Effects of growth temperature, oxygen source, and postdeposition annealing J. Vac. Sci. Technol. A 31, 01A127 (2013); 10.1116/1.4768167 Optical and structural properties of SiO x films grown by molecular beam deposition: Effect of the Si concentration and annealing temperature J. Appl. Phys. 112, 094316 (2012); 10.1063/1.4764893Influence of chemical composition and deposition conditions on microstructure evolution during annealing of arc evaporated ZrAlN thin films Securing the thermal robustness of thin hafnium oxide ͑HfO 2 ͒ film on the semiconductor surface is an important technical issue in the fabrication of the metal-oxide-semiconductor field-effect transistor devices, as the HfO 2 -based high-k gate stacks usually undergo high-temperature processes. In this study, the structural development of thin HfO 2 film on a Ge surface during postdeposition annealing in an ultrahigh vacuum was examined to explore the origin for the initial degradation of thin HfO 2 film. Void nucleation and subsequent two-dimensional void growth take place at 780-840°C, while the chemical composition of the remaining Hf oxide is virtually stable. Both the void nucleation and growth processes show similar larger activation energy of about 10 eV. Based on the observed manner of void growth and the estimated activation energies, the authors propose that mass transport on the HfO 2 surface is responsible for void nucleation in the HfO 2 films on Ge. The authors also compare the present results with the previous studies on HfO 2 / Si structures, and suggest that similar surface process leads to the local Hf silicidation.