2021
DOI: 10.1134/s1063785021030172
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Electron-Beam Crystallization of Thin Films of Amorphous Silicon Suboxide

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Cited by 3 publications
(6 citation statements)
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“…In this case, the NC-Ge are clearly subjected to mechanical compression, and their sizes cannot be determined from the analysis of the Raman spectra. The occurrence of mechanical compression stresses has already been detected after the complete crystallization of SiO x films using EBA [19]. The reasons for the occurrence of such stresses and their influence on the crystallization kinetics have not yet been specified and will be the subject of further research.…”
Section: Analysis Of Obtained Resultsmentioning
confidence: 99%
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“…In this case, the NC-Ge are clearly subjected to mechanical compression, and their sizes cannot be determined from the analysis of the Raman spectra. The occurrence of mechanical compression stresses has already been detected after the complete crystallization of SiO x films using EBA [19]. The reasons for the occurrence of such stresses and their influence on the crystallization kinetics have not yet been specified and will be the subject of further research.…”
Section: Analysis Of Obtained Resultsmentioning
confidence: 99%
“…Further, to anneal the as-deposited films, an electron beam generated by a discharge electron gun with a hollow cathode was used [18]. The current density of the electron beam was 20 mA/cm 2 at an accelerating voltage of 2000 V. The choice of the annealing mode parameters is due to the results from the article [19], where it is shown that for an electron beam with an accelerating voltage of 1000 V and a current of 100 mA, even at an annealing time of 600 s, polysilicon was not formed, and the action of an electron beam with an accelerating voltage of 3000 V and a similar current led to the evaporation of a-SiO x :H thin film for 60 s. The sample surface area of electron beam irradiation beam was 0.3 cm 2 . The samples were placed perpendicular to the electron beam in a vacuum chamber with a pressure of 10 −2 Pa.…”
Section: Experiments Descriptionmentioning
confidence: 99%
“…Thus, organosilicon oligomers and polymers are "ideal" sources for obtaining ultrapure silicon ceramics and silicon nanoparticles [2,4].…”
Section: Introductionmentioning
confidence: 99%
“…In practice, organochlorosilanes of the general formula (R x SiCl 4−x ), polyorganosilanes whose main chain consists of silicon atoms (≡Si-Si≡) with side organic substituents, polyorganocarbosilanes (containing Si-C, Si-Si bonds), polyorganosiloxanes of the general formula R x Si(OR 1 ) 4−x (where R and R 1 are organic groups), tetraethoxysilanes of the general formula Si(OR) 4 , and others are used as initial silicon compounds for ceramics production [5].…”
Section: Introductionmentioning
confidence: 99%
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