Electromigration test on via line structure with a self-heated method

Realistic modeling of electromigration in today�??s ULSI interconnections

“…Various highly accelerated stress methods are developed, however most of them have resulted in different mechanisms of EM as compared to that in their corresponding standard reliability tests, rendering invalidity of the test data for reliability evaluation of products [72]. For other highly accelerated stress methods, the situation of maintaining the same mechanism of EM are not clear [73].…”