Abstract:The main trends in consumer electronics are increasing performances of their products and a reduction of the costs. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and void formation due to electromigration (EM). Against this background copper pillar bumps were introduced, because they combine the robustness of metal wire bonds with the low bonding pressure of reflow sold… Show more
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