2000
DOI: 10.1049/el:20000657
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Electromigration-induced failure of GaN multi-quantum well light emitting diode

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Cited by 41 publications
(26 citation statements)
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“…This result of Ref. [9] is in agreement with the previous study [2,3], indicating that the main degradation mechanism of GaN-based LEDs is the worsening related to the series resistance due the electromigration of the contact metal through the defects [2] or diffusion of the hydrogen from the passivation layer to the p-type region [3].…”
Section: Resultssupporting
confidence: 91%
See 1 more Smart Citation
“…This result of Ref. [9] is in agreement with the previous study [2,3], indicating that the main degradation mechanism of GaN-based LEDs is the worsening related to the series resistance due the electromigration of the contact metal through the defects [2] or diffusion of the hydrogen from the passivation layer to the p-type region [3].…”
Section: Resultssupporting
confidence: 91%
“…These mechanisms include degradation of the contacts due to the electromigration of the metal, generation of the point defects and dislocations in the active region, and thus generation of non-radiative recombination centers, and degradation related to the passivation layers and packaging [2]. For these mechanisms of degradation the decrease of the output power is accompanied by the increase of the forward voltage drop at high currents [3] and increase of the non-radiative recombination at low currents [4].…”
Section: Resultsmentioning
confidence: 99%
“…By comparing the EL images, surface-temperature profile and XRF element distribution, a reversebias emission emits from the border, or the contact of the central chip area where high electric field may occur due to weak structures or structural defects [15][16][17][18][19]. This area is vulnerable to metal migration [7,20] at the border of metal contact. The weak structure or the structural defects may be a result of process variation since the reverse-bias electroluminescence behavior differs among several devices.…”
Section: Experiments and Discussionmentioning
confidence: 99%
“…Therefore, numerous of studies have been conducted until now to unveil the GaN LED reliability issue. In LED industry, stress test around 6000 h is required [6,7]. This study provides fast screening techniques and locating the weakness promising for future LED industrial applications.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, there are just few papers on noise investigation in LED structures 13,15,17,18 . Quality and reliability investigation of LEDs mostly is based on the analyses of current-voltage characteristic changes during accelerated aging 15,16,19 . Noise characteristics are used only for noise level evaluation, but not for physical processes in LED structure that are related with device degradation revealing.…”
Section: Introductionmentioning
confidence: 99%