Electromigration-driven complex dynamics of void surfaces in stressed metallic thin films under a general biaxial mechanical loading

Abstract

Articles you may be interested inEffect of applied stress tensor anisotropy on the electromechanically driven complex dynamics of void surfaces in metallic thin films J. Appl. Phys. 110, 063705 (2011); 10.1063/1.3638070 Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermalstress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications J. Appl. Phys.