Electromigration and failure analysis for copper pillar bump in QFN package

Hsieh, Yi-Shu; Wu, Shang-Lin; Cheng, Kuan-I; Wu, Sung‐Mao; Lu, Tung-Bao; Lu, Liang-Tian

doi:10.23919/icep.2017.7939441

2017 International Conference on Electronics Packaging (ICEP) 2017

DOI: 10.23919/icep.2017.7939441

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Electromigration and failure analysis for copper pillar bump in QFN package

Yi-Shu Hsieh

Shang-Lin Wu

Kuan-I Cheng

et al.

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Electromigration and failure analysis for copper pillar bump in QFN package

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