Electromechanical-Metallurgical Probe Contact Wear Effects of PdCuAg Alloy in Cycling Contact With SAC 305 Solder: Semiconductor Test and Ball Grid Array Packaging

Sanchez, R. Martinez; Garay, Carlos; Santillan, J. Aguilar

doi:10.1109/tcpmt.2018.2794883

IEEE Trans. Compon., Packag. Manufact. Technol.

2018

DOI: 10.1109/tcpmt.2018.2794883

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Electromechanical-Metallurgical Probe Contact Wear Effects of PdCuAg Alloy in Cycling Contact With SAC 305 Solder: Semiconductor Test and Ball Grid Array Packaging

R. Martinez Sanchez

Carlos Garay

J. Aguilar Santillan³

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Electromechanical-Metallurgical Probe Contact Wear Effects of PdCuAg Alloy in Cycling Contact With SAC 305 Solder: Semiconductor Test and Ball Grid Array Packaging

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References 30 publications

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