Electromagnetic simulation to predict EMC immunity behavior of an aeronautic board

Abstract

Nowadays, the obsolescence of an electronic component is solved by trial and error approach: the component is changed by another equivalent one and EMC requirement is checked. Integrated Circuit obsolescence is an economic constraint for electronic suppliers.In order to consider the obsolescence on electronic components, it is necessary to establish a methodology aiming to guarantee the non-regression of EMC performances of equipment during an immunity test.We propose a new methodology to predict immunity of component during the electronic board design. The component model developed is based on EMC measurement.The authors compare measurements with simulations using the proposed model and demonstrate the validity of this approach.

Electromagnetic Immunity Performance of Intelligent Electronic Equipment in Smart Substation’s Electromagnetic Environment

“…The average value of the upper envelope y and the time x was 104.1251 and 4.9999 respectively. Subtracting the x and y values from the sample data, and then calculating the total covariance gave us Cov = 20.9439 −0.4468 −0.4468 0.1874 (14) The diagonal line is the variance of x and y, and off-diagonal is the covariance.…”

“…Concerning the immunity testing, some scholars have already researched the test on EMC [13][14][15][16]. Trenkler and McBride developed the test methods to characterize the shield performance when the equipment under test (EUT) was applied to metal sheets [17].…”