Electromagnetic radiation and simultaneous switching noise in a CMOS device packaging

Implementation of Voltage Controller of Single-phase Self-excited Induction Generator

“…The decoupling capacitor of 47 μF is used in the proposed scheme. Various research works [10,19] in the area of EMI and radiations reported that CMOS ICs used for switching operations generate high-frequency radiation and conduct noise in a printed circuit board that the printed circuit board (PCB) copper tracks act as unwanted antenna. The CMOS ICs, which perform faster switching operations, feed more frequency currents to this undesired antenna.…”

“…The low-frequency current to the IC is supplied by the PCB copper tracks. The value of the decoupling capacitor should be sufficiently large and should supply required the high-frequency current to the IC at power pins [10]. The bounce noise voltage is…”

“…The function of the gate protection circuit is to provide protection to the gate of thyristors from excess gate current and negative voltage pulses. The second input to the AND gates is fed by the firing pulse train generator in block (10) in Figure 1(a), which is a square-wave signal generated by a stable multi-vibrator made of an NE 555 timer integrated circuit (IC). …”

“…Numerous publications on steady-state and dynamic analysis of self-excited induction generators (SEIGs) and several schemes for improving voltage regulation of SEIGs based on the electronic load controller (ELC), static VAR compensator (SVC), and distribution static compensator (DSTATCOM) have been well documented in [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18]. For constant voltage operation at varying loads, it is necessary to adjust the excitation reactive power continuously with loads.…”

Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign

“…This will minimize the effect of the return path inductance. In [5], [10], [9], the effects of shielding, return path and reference plane are considered in package and PCB designs. However, the optimal design, in terms of signal integrity concern, will create such signal-pin blocks which have fewer signal pins within a large block area.…”