Electromagnetic modeling of package parasitics in SAW-duplexer

Makkonen, T.; Plessky, V.P.; Kondratiev, S.N.; Salomaa, M.M.

doi:10.1109/ultsym.1996.583777

Cited by 18 publications

(7 citation statements)

References 6 publications

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“…It is important to note that the mismatching effects could modify the behaviour of the circuit: an example were presented in [25]. Parasitic effects are important at UHF frequencies or higher and even the wires used to bond the SAW devices could be important [32]. For this reason, some authors have showed a method to consider them through simulations [24, 25].…”

Section: Fabrication and Characterisation Of The Delay Linementioning

confidence: 99%

Theoretical and experimental characterisation of a SAW delay line through its Y ‐matrix

Guerra-Pulido

Pérez-Alcázar

Álvarez‐Zauco

2016

IET Circuits, Devices & Systems

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Surface acoustic wave (SAW) delay lines are commonly used devices, and it is important to characterise them to find the causes of deviations between the experimental and theoretical behaviour in order to consider them during design. The authors present the theoretical characteristics and the characterisation of a SAW delay line through X-ray diffraction, energy dispersive X-ray fluorescence, scanning electron microscopy, atomic force microscopy and the measurement of S-parameters. Using the S-parameters, the Y-parameters were calculated and comparing them with those obtained theoretically, they found disagreement in their magnitudes and also that the experimental SAW velocity was 2.8% larger than the theoretical one. The magnitude of experimental Y11 is smaller than that obtained theoretically because of the ill-defined profile and the metallisation ratio of the electrodes is not ideal due to inherent limitations in the fabrication process, and besides Y21 is smaller than expected because the attenuation of the SAW when it propagates through the delay line. When the electrode defects, the experimental SAW velocity and the attenuation coefficient of SAW in this material are considered in the theoretical calculations, agreement is found between theoretical and experimental results. This procedure is based in the comparison between experimental and theoretical Y-parameters and could be used to estimate attenuation, electrode capacitance and SAW velocity.

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Section: Fabrication and Characterisation Of The Delay Linementioning

confidence: 99%

Theoretical and experimental characterisation of a SAW delay line through its Y ‐matrix

Guerra-Pulido

Pérez-Alcázar

Álvarez‐Zauco

2016

IET Circuits, Devices & Systems

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“…Finally, the influence of parasitic impedances, such as those from bonding pads, wires and package must be taken into account. 59) This is because even tiny wire inductances give significant influences on device performances in the GHz range. Parasitic impedances are estimated experimentally and/or by the use of commercial software tools such as Ansoft HFSS.…”

Section: Flow Of Numerical Simulationmentioning

confidence: 99%

Simulation of Surface Acoustic Wave Devices

Hashimoto

2006

jjap

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This paper reviews simulation technologies used in research and development of modern surface acoustic wave (SAW) filters. First, a simple discussion is presented on the flow of the numerical simulation to clarify its applicability and the need for it. Then two types of simulation techniques are discussed. The first type is based on the behavior model where the calculation speed is very crucial. Flow of the coupling-of-modes analysis is given as an example, and its use in practical device design is detailed. The second type is the full-wave analysis where precision is more important than the calculation speed. It is shown how these techniques are applied in the parameter extraction for the behavior model. Then a discussion is given on the simulation of devices using shear-horizontal SAWs where the interaction with bulk acoustic waves is significant. It is shown how the interaction should be taken into account for the device simulation. Finally, various hot topics in this direction are presented, and hidden problems in current simulation tools are revealed.

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“…The number of filaments is determined automatically. In contrast, with EM-2, a second exponential meshing scheme [4], the number of filaments is specified a priori. This meshing scheme then holds the smallest filament width at the skin depth, and adjusts the ratio between adjacent filaments so as to fit the filaments inside the given width w. More precisely, given a conductor of width w and N, the number of desired filaments, the ratio r between adjacent filaments satisfies w 2δ r N 2 1 r 1 even N,…”

Section: Adaptive Meshing Schemesmentioning

confidence: 99%

Adaptive admittance-based conductor meshing for interconnect analysis

Yang

Koh

Balakrishnan

2006

Proceedings of the 2006 Conference on Asia South Pacific Design Automation - ASP-DAC '06

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We present a new algorithm for discretizing interconnects, a step that is typically performed to account for the nonuniformity of current flow at high frequencies. The algorithm is based on an easily-computable measure that correlates well with the model accuracy. This measure is used to refine the discretization of interconnects in an adaptive scheme so as to systematically trade off computation against model accuracy. We apply the proposed discretization technique on two classes of problems in the analysis of VLSI interconnects: simulation and frequency-dependent inductance extraction. Numerical results establish that with the interconnect discretizations generated by our algorithm, a reduction in simulation and extraction times by a factor between three and seven can be realized with negligible sacrifice in model accuracy ( 1% error).

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Electromagnetic modeling of package parasitics in SAW-duplexer

Cited by 18 publications

References 6 publications

Theoretical and experimental characterisation of a SAW delay line through its Y ‐matrix

Theoretical and experimental characterisation of a SAW delay line through its Y ‐matrix

Simulation of Surface Acoustic Wave Devices

Adaptive admittance-based conductor meshing for interconnect analysis

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