2005 IEEE Antennas and Propagation Society International Symposium
DOI: 10.1109/aps.2005.1551875
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Electromagnetic metamaterial insulator to eliminate substrate surface waves

Abstract: Metamaterial EM insulators are designed to eliminate mutual coupling between closely packed array elements. This technique allows for array element design in isolation, without consideration of mutual coupling effects. Eliminating mutual coupling also allows for denser packing and higher directivity in antenna arrays. By placing Isolation Walls along the radiating edges of a patch on a 4I3x4'3 groundplane a 19.2dB front-toback ratio is achieved. Metamaterial Isolation walls 0.05A4 thick exhibit -10 dB isolatio… Show more

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Cited by 13 publications
(6 citation statements)
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“…Thus, it is an exciting area for researchers to explore these unique properties and their relations for different metamaterials and apply them in various electromagnetics and antenna applications. Due to their unique band gap features, EBG structures can be regarded as a special type of metamaterials [4,5,9]. When they interact with electromagnetic waves, exciting phenomena appear and amazing features result.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, it is an exciting area for researchers to explore these unique properties and their relations for different metamaterials and apply them in various electromagnetics and antenna applications. Due to their unique band gap features, EBG structures can be regarded as a special type of metamaterials [4,5,9]. When they interact with electromagnetic waves, exciting phenomena appear and amazing features result.…”
Section: Introductionmentioning
confidence: 99%
“…These array structures are used for high gain applications [1]. Along with advantages these structures also have some drawbacks majority of which is mutual coupling between elements, this occur due to surface waves, space waves and covering of close fields results poor performance of an array [2]. In array design the coupling is effected by permittivity and thickness of substrate, size of ground plane, type of excited modes and gap between elements etc.…”
Section: Introductionmentioning
confidence: 99%
“…Numerous techniques were studied and applied to alleviate mutual coupling in an array that includes cavity backing, partial substrate removal, corrugations, split ring resonators (SRR), defected ground structures (DGS), periodic structures like high impedance electromagnetic surfaces (HIES) or electromagnetic bandgap structures (EBG) etc . [3,4,5,6,7]. Integration HIES/EBG structures in a microstrip antenna array are quite attractive for their ability to suppress surface waves and reduce the mutual coupling effects.…”
Section: Introductionmentioning
confidence: 99%