Electromagnetic Field Measurements Above On-Wafer Calibration Standards

Votsi, Haris; Urbonas, Jonas; Iezekiel, Stavros; Aaen, Peter H.

doi:10.1109/arftg49670.2021.9425326

Cited by 4 publications

(2 citation statements)

References 14 publications

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“…Calibration standards, also known as calibration parts, mainly include mechanical calibration, electronic calibration, and on-wafer calibration. In cases where on-wafer calibration is mainly used for wafer measurement [8], mechanical calibration is a single-port or two-port device with known characteristics.…”

Section: Calibration Standardmentioning

confidence: 99%

Research on the UOSM four-port Calibration algorithm and determination method of the Transmission error term

Du,

Chen,

et al. 2024

J. Phys.: Conf. Ser.

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As one of the key techniques for vector network analyzers to achieve high precision measurement, calibration, and error correction technology has always been the focus of continuous exploration and innovation. UOSM calibration algorithm uses unknown straight-through transmission standards that do not need to be defined and known open-circuit standards, short-circuit standards, and matching standards to calibrate microwave and millimeter wave bands. Based on the study of the mature UOSM calibration algorithm, this paper proposes a method of self-calibration and comparison of the measurement data based on the unknown cut-through standard, which no longer needs the group delay parameters of the unknown straight-through standard and reduces the dependence on the calibrator. The accuracy of the algorithm and error item determination method is verified by ADS simulation and instrument actual test, and a good calibration effect is achieved. It is proved that the algorithm has the ability of accurate calibration. Due to the reduction of parameters, the stability and applicability of the algorithm are improved.

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Section: Calibration Standardmentioning

confidence: 99%

Research on the UOSM four-port Calibration algorithm and determination method of the Transmission error term

Du,

Chen,

et al. 2024

J. Phys.: Conf. Ser.

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“…One of these challenges is an understanding of the link between the positioning of such probes and their inherent mechanical flexibility. This is particularly important in terms of the impact of positional errors on optimum electrical contact [6]; something that has been studied in rigid commercial probes [7][8][9][10][11][12][13][14]. In contrast, the micromechanical behaviour (bending and twisting) of miniature microcantilever-based probes must be taken into account for optimum probe contacting [15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Arscott

2024

Eng. Res. Express

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Some new issues concerning the contacting and positioning of small electrical microelectromechanical systems (MEMS) probes based on multiple, flexible microcantilevers are presented here. A tilt error, associated with the lateral probe roll, means that contact touchdown occurs sequentially in different cantilevers upon increasing probe overtravel. To understand the relationship between probe overtravel, tip skate, tip planarity, tip tangency, and contact force in the different contacts, the relationship between mechanical bending and torsion of the flexible cantilevers needs to be accounted for. The study reveals the conditions for achieving contact planarity and desired contact force, as well as the identification of a new ‘differential skate error’ contact misalignment associated with such MEMS probes based on multiple, flexible microcantilevers. This misalignment leads to a ‘differential contact force error’ which has implications for electrical contact quality. An experimental scale model probe based on three cantilevers is used to test the modelling—the results agree well with the predictions of the model. Interestingly, the experiments revealed an effect not accounted for in the modelling; this ‘twist error’ resulted in the cantilever lead edge not being parallel to the touchdown plane. The findings may be useful for engineers involved with the automatic control positioning of such emerging miniature probes, especially in terms of the impact of probe positioning errors.

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Microstrip and Grounded CPW Calibration Kit Comparison for On-Wafer Transistor Characterization from 220 GHz to 325 GHz

Jones,

Cheron,

Bosworth

et al. 2023

2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

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Electromagnetic Field Measurements Above On-Wafer Calibration Standards

Cited by 4 publications

References 14 publications

Research on the UOSM four-port Calibration algorithm and determination method of the Transmission error term

Research on the UOSM four-port Calibration algorithm and determination method of the Transmission error term

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Microstrip and Grounded CPW Calibration Kit Comparison for On-Wafer Transistor Characterization from 220 GHz to 325 GHz

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