2012
DOI: 10.1016/j.apsusc.2012.06.012
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Electroless ternary NiCeP coatings: Preparation and characterisation

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Cited by 15 publications
(9 citation statements)
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“…In this context, co-deposition of several elements such as copper, cobalt, tin and cerium has been carried out to modify the original properties of regular Ni-P coatings [7][8][9][10] . Properties such as thermal stability, corrosion resistance, electronic conductivity and wear resistance can be improved by properly controlling bath conditions and composition 11,12 .…”
Section: Introductionmentioning
confidence: 99%
“…In this context, co-deposition of several elements such as copper, cobalt, tin and cerium has been carried out to modify the original properties of regular Ni-P coatings [7][8][9][10] . Properties such as thermal stability, corrosion resistance, electronic conductivity and wear resistance can be improved by properly controlling bath conditions and composition 11,12 .…”
Section: Introductionmentioning
confidence: 99%
“…The observations of diminished levels of P (or B) in EL metal deposits and altered EL bath stability are attributed to similar mechanisms. Specifically, any blockage of H 2 PO 2 – (or DMAB or BH 4 – ) binding sites on the surface by adsorbed lanthanides will naturally decrease the chances of P (or B) incorporation into the deposited metal ,,,, per eq (note Boron section) for B and eq and the following reactions for P: Ni 0 + normalH 2 PO 2 normalP 0 postfixfalse↓ infix+ NiOH ads + OH normalH 2 PO 2 + normalH ads normalP 0 postfixfalse↓ infix+ normalH 2 normalO + OH In addition, the ability of surface-active lanthanides to promote release of H 2 gas from the surface lowers the effective surface concentration of H • ads per eq required for P deposition …”
Section: Elementsmentioning
confidence: 99%
“…204,719,723,733 The observations of diminished levels of P (or B) in EL metal deposits and altered EL bath stability are attributed to similar mechanisms. Specifically, any blockage of H 2 PO 2 − (or DMAB or BH 4 − ) binding sites on the surface by adsorbed lanthanides will naturally decrease the chances of P (or B) incorporation into the deposited metal 719,721,722,728,731 per eq 56 (note Boron section) for B and eq 73 and the following reactions for P:…”
Section: Acs Applied Electronic Materialsmentioning
confidence: 99%
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“…Insertion of hard nanoparticles (e.g., C, Ti-Si-C, W, Ti-N, etc.) improve the properties of the alloy [9][10][11][12][13][14][15][16][17][18][19]. As the tungsten content increase the life time of the alloy increase, since Ni-W-P barrier have longer life time than Ni-P barrier [20].…”
Section: Introductionmentioning
confidence: 99%