Electroless Platinum Deposition Using Co3+/Co2+ Redox Couple as a Reducing Agent

Abstract

In the present work, the kinetics of electroless deposition of Pt, using a cobalt ion redox system (Co3+/Co2+) as a reducing agent, has been investigated. The deposition rate of Pt depends on the pH, concentration of reactants, and temperature. The deaeration and bubbling of the plating solution with argon play an essential role. It was found that 0.11 mg cm−2 of Pt films could be deposited on the surface of a roughed glass sheet in one hour without replenishing the solution. Additional data have been obtained on the grounds of electrochemical quartz crystal microbalance experiments. The bubbling (agitation) of the electroless Pt plating solution with argon during the deposition of Pt results in a higher deposition rate and is ca. 3 µg cm−2 min−1. The Pt deposition rate is far less, and is as low as 0.14 µg cm−2 min−1 when the electroless Pt plating solution is not bubbled with argon during the deposition of Pt.

Nanoporous Anodic Alumina Photonic Crystals for Sunlight Harvesting Applications: A Perspective

“…For instance, the oxidation of complexed metal ions (i.e., Co 2þ to Co 3þ ) could be used to reduce other metals (e.g., Ag, Pt) to coat the substrate or template. [101,102] One advantage of electroless plating over other deposition techniques is its simplicity in terms of instrumentation. Furthermore, substrates of various materials and shapes, including nanoporous templates with high aspect ratios, can be coated with functional materials via this deposition technique.…”

Electroless Metallization of the Elements: Survey and Progress

“…For example, Horiuchi et al 393 report adherent EL Pt deposition at 50 °C onto PS or PET substrates treated with cationic surfactants that bind anionic Pd NPs using a simple aqueous bath containing H 2 PtCl 6 and ascorbic acid as a reducing agent. Tamasǎuskaite-Tamasǐu ̅ naitėand co-workers 394 have used a simple pH 7.5 aqueous bath containing H 2 PtCl 6 and Co II complexes of NH 3 and diethylenetriamine (i.e., H 2 N-(CH 2 ) 2 NH(CH 2 ) 2 NH 2 ) ligand to plate EL Pt onto Pd/Sn colloid catalyzed glass substrates at ∼20 °C. The bath outperforms an EL Pt bath containing N 2 H 4 and EDA operating at 35 °C, depositing ∼3 times the amount of Pt during the same time.…”

Development of a Simple Electroless Method for Depositing Metallic Pt-Pd Nanoparticles over Wire Gauge Support for Removal of Hydrogen in a Nuclear Reactor

“…It has been noted previously that the presence of complexing agents causes a bright metallic covering that is ineffective as a catalyst [35]. Depending on the type of coating required and its uses, the coating procedure can be carried out at different temperatures and pH levels, with or without the addition of stabilizing or complexing agents [36]. In this article, we report room-temperature deposition of metallic Pt-Pd nanoparticles over a wire gauge support without the use of a complexing agent, without alteration in pH, and without using any inert gas bubbling (Argon) or agitation to meet our demand for an amorphous noble metal coating with improved surface heterogeneity.…”