Electroless nickel plating onto Plexiglas® through simple covalent grafting of vinylpyridine seed layer

Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro‐/Nano‐fabricated Devices

“…2À complex which is electrostatically linked to the protonated amine groups. [11] This Pd 3d spectrum is best fitted with two signals at 343.0 and 337.7 eV for 3d 3/2 and 3d 5/2 peaks, respectively.…”

“…Here we propose the one-step diazonium induced anchoring process to modify silicon nitride ceramic as it has been proven efficient toward direct covalent functionalization of various surfaces (semiconductors, conductors, and plastics) with amine-terminated groups without requiring any surface pre-treatment. [11,16,17] We thus characterize the pristine and modified surfaces with X-ray photoelectron spectroscopy to get more insight into the diazonium modification. Since the discovery of diazonium-induced anchoring process in the years in 2010, [18] applications of this one-step chemical process have been extended in various areas, protection against corrosion of stainless steel [19] or enhancement of desalination performance.…”

“…is tarnished from the fact this route encounters very challenging multiple-step chemical processes. [1,11] Thus, we aim at leveraging from the diazonium-based amination of silicon nitride to provide a simple metallization route. Indeed, these amine groups can be easily activated by immersing the substrate in a PdCl 2 /HCl solution for only a few minutes which protonate the amine groups (positively charged).…”

“…[2][3][4]10] In particular for chemical metallization of insulating thin films (ceramic, oxide, and plastic), and in general for many other applications in micro/nano electromechanical systems, research efforts have thus focused on the development of new silane-free surface modification approaches. [4,9,[11][12][13] There exist only a very few publications on the electroless plating onto silicon nitride without using the silanization process. [1,14] These routes require a special surface pretreatment (oxygen plasma cleaning followed by HF etching step to leave a H-terminated surface with Si-H, NH, and NH 2 moieties) prior to electroless plating.…”

Fabricating patterned polyelectrolyte brushes by dynamic microprojection lithography for selective electroless metal deposition

“…Over the decades, the study of grafting polymer in a PAELD process generally follows either the "grafting-from" or the "grafting-to" route. [23][24][25] No matter using the in situ polymerization (e.g., SI-ATRP) of the functional monomer initiated from the substrate surface, 26 or using the direct reaction between presynthesized polymers and the substrate surface, 25 most polymer grafting methods are timeconsuming and possess-complicated procedures. To date, with the development of lithography technology and photochemistry, manipulating the surface/interface polymerization through the light modulation to achieve programmable polymeric patterns have attracted people's attention.…”