2017
DOI: 10.1149/2.0081705jes
|View full text |Cite
|
Sign up to set email alerts
|

Electroless Metallization of Stereolithographic Photocurable Resins for 3D Printing of Functional Microdevices

Abstract: In the present paper the electroless metallization of 3D printed devices using stereolithography is investigated. Two different photocurable resins from a commercial supplier and a self-formulated one are used as starting materials for printing. A first metal layer of NiP or Cu, obtained by an optimized pretreatment and plating process, is subsequently applied on the parts. The possibility of obtaining multilayers through the successive electrodeposition of different metals on the electroless treated parts is … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
20
0

Year Published

2017
2017
2022
2022

Publication Types

Select...
5
1
1

Relationship

0
7

Authors

Journals

citations
Cited by 46 publications
(23 citation statements)
references
References 25 publications
0
20
0
Order By: Relevance
“…In order to accomplish polymer conversion, the SL-printed models were post-cured for 15 min. Metallization of the samples has been performed employing a process already developed [3]. After the application of a first electroless Cu layer of 0.5 µm, a second 1.5 µm layer of electrolytic Cu was deposited.…”
Section: Mechanical Design and Fabrication Processmentioning
confidence: 99%
See 1 more Smart Citation
“…In order to accomplish polymer conversion, the SL-printed models were post-cured for 15 min. Metallization of the samples has been performed employing a process already developed [3]. After the application of a first electroless Cu layer of 0.5 µm, a second 1.5 µm layer of electrolytic Cu was deposited.…”
Section: Mechanical Design and Fabrication Processmentioning
confidence: 99%
“…In this work, a polymeric z-axis accelerometer is fabricated by means of SL and wet metallization that provides surface conductivity, which is necessary to obtain a capacitive readout of the z-axis accelerometer [3]. The proposed device has dimensions in the order of hundreds of µm and constitutes a first step towards the realization of 3D printed accelerometers, which may represent an alternative to MEMS-based devices in applications where miniaturization is not mandatory while customization is desirable.…”
Section: Introductionmentioning
confidence: 99%
“…NiP was therefore deposited on CoNiP according to a methodology already used. 41 Final thickness was found to be 1.1 mm and the phosphorus content to be 2.5 wt%.…”
mentioning
confidence: 90%
“…Properties of the first Cu layer, deposited on DL260, have been investigated in a previous work. 41 The mean thickness of the coating, as a consequence of the low temperature used during the deposition, was found to be around 400 nm. Adhesion to the substrate, qualitatively evaluated by means of a peel test, was found to be good.…”
mentioning
confidence: 99%
See 1 more Smart Citation