Electroless Fabrication of Nanostructures

Osaka, Tetsuya

doi:10.1007/978-0-387-73582-5_8

Cited by 1 publication

(2 citation statements)

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“…Ternary alloys with these same elements and Mo, W, or Re are also readily prepared ( cf ., Molybdenum and Tungsten section and the Rhenium section). These wear-resistant alloys find use as Cu diffusion barriers in electronics applications ,, and, in alloys containing higher levels of B, as metallic glasses . Readers interested in further examples are requested to consult related sections of this article ( e.g ., Molybdenum and Tungsten section, Rhenium section, Iron section, Cobalt section, and the Nickel section) and two recent reviews of EL NiB alloys. , …”

Section: Elementsmentioning

confidence: 99%

“…The stringent requirements of modern electronics for the development of EL processes for precise control of the placement, dimensions, and morphology of metal components present as integral parts of ICs have, in turn, spurred uses in unrelated fields. Today EL metal applications also include Microelectromechanical Systems (MEMs), − magnetic materials, ,− advanced heating elements, chemical sensors, biodegradable electronics, forensic fingerprint visualization, enhancement, and preservation, − anticounterfeiting materials, , superhydrophobic surfaces for controlled wettability, − materials for enhanced electromagnetic interference (EMI) shielding, − lightweight battery, transparent, − and catalyst functionalized electrodes, − reproducible substrates for Surface-Enhanced Raman Spectroscopy (SERS), − passive electronic components, − permeable membranes, , wastewater remediation, energy storage, − self-healing materials, , composites, ,, supported metal and alloy catalysts, ,− and advanced optical materials, including metamaterials. , …”

Section: Introductionmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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