Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization

Qiu, Lina; Ni, Zi-Hong; Wang, Yingjie; Hu, Chunfeng; Qu, Xin-Ping

doi:10.1149/1945-7111/ac81fc

Cited by 9 publications

(4 citation statements)

References 44 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Co and Co alloy films have long been studied as diffusion barriers to prevent electromigration of Cu during operation of ICs. ,,,− Readers desiring general information about the role of cobalt in diffusion barriers are directed to the excellent review by Hauschildt et al EL Co is especially important as a potential replacement for Cu interconnects as IC feature sizes decrease because metal electrical resistivity increases as feature sizes shrink. Because Co resistivity is less affected by downsizing compared to Cu, Co resistivity of sub-7 nm Co features is less than that of Cu.…”

Section: Elementsmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

show abstract

Section: Elementsmentioning

confidence: 99%

Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

show abstract

“…These properties are particularly beneficial for applications in advanced integrated circuit assemblies in the post-Moore’s law era. Therefore, cobalt is expected to be a new generation of interconnection material instead of traditional copper. − …”

Section: Introductionmentioning

confidence: 99%

Inhibitor Alkyne-PEG4-amine Contributes to Cobalt Superfilling

Tong,

Lai,

et al. 2024

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

In the field of electronic plating, the addition of additives is the key to achieve cobalt superfilling, while finding and researching suitable additives is a major challenge. In this work, alkyne-PEG4-amine (AP4A) was used as an inhibitor to achieve nanometer scale superfilling of cobalt electrodeposition. The inhibition of AP4A was analyzed by electrochemical methods, including cyclic voltammetry and chronopotentiometry tests. AP4A effectively inhibits the cobalt electrodeposition, adsorbing onto the surface of the electrode and showing an outstanding ability for polarization. Quantum chemical calculations show that the amino group within AP4A may be the main active site for reaction, which possesses capacity for donating electrons. Furthermore, surface morphology and crystalline structure characterizations indicate that, under the effect of AP4A, the cobalt film maintains excellent electrical properties while obtaining better flatness and preferential orientation of the (101) crystal plane. In superfilling of nanometer scale structures with high aspect ratios, AP4A was used and the bottom-up electrodeposition of cobalt was successfully achieved, which demonstrates that AP4A is an effective inhibitor for cobalt superfilling and offers an excellent solution strategy in electrodeposition area.

show abstract

“…Electroless deposition, on the contrary, is an all-wet process that metallizes insulating substrates using chemical reactions [42][43][44][45][46][47][48]. It can create thin metallic layers on various metals and non-metals [49][50][51][52][53][54][55][56][57][58][59][60]. In PCB manufacturing, electroless copper deposition is extensively used to deposit thin copper layers on panels as large as 100 cm [61,62].…”

Section: Introductionmentioning

confidence: 99%

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Pawar

Dixit

2022

Surface Engineering

View full text Add to dashboard Cite

This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.

show abstract

Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization

Cited by 9 publications

References 44 publications

Electroless Metallization of the Elements: Survey and Progress

Electroless Metallization of the Elements: Survey and Progress

Inhibitor Alkyne-PEG4-amine Contributes to Cobalt Superfilling

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Contact Info

Product

Resources

About