Electroless deposition of NiWB alloy on p-type Si(100) for NiSi contact metallization

Duhin, Alla; Sverdlov, Yelena; Feldman, Yishay; Shacham‐Diamand, Yosi

doi:10.1016/j.electacta.2009.01.062

Cited by 15 publications

(4 citation statements)

References 12 publications

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“…In the case of experimental, unreplenished baths, the structure and the composition of the coating are not homogeneous over the coating thickness but change during the deposition, as was shown in the extreme case of a non-agitated bath by Rao et al [23]. However, the observation of the formation of nickel-boron deposits has not been studied extensively yet, opposite to the growth of nickel-phosphorous coatings that has been studied on various substrates with and without catalytic activation [17][18][19][20][21][22][24][25][26][27]. It is also well known by the electroless platers that the state of the substrate has a great influence not only on the plating process, but also on the coating properties [28,29]: surface roughness can for example affect the coating appearance.…”

Section: Introductionmentioning

confidence: 93%

“…Either the substrate is spontaneously catalytic for the oxidation of the reducing agent, or it is more easily oxidizable than nickel, in which case a thin catalytic layer of nickel is spontaneously deposited, or finally it can be activated by dipping in a solution of catalytically active metal salts (like Pd) or by galvanic coupling [4]. The few studies dedicated to the initiation mechanism of electroless deposition focused on systems in which catalysts, such as Pd are used [17][18][19][20][21][22]. This means that if no catalyst is used, the actual mechanism that allows initial deposition on a determined substrate is rarely known and is at best proposed by assumptions.…”

Section: Introductionmentioning

confidence: 99%

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Initiation and formation of electroless nickel–boron coatings on mild steel: Effect of substrate roughness

Vitry

Kanta

Delaunois

2010

Materials Science and Engineering: B

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Section: Introductionmentioning

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Initiation and formation of electroless nickel–boron coatings on mild steel: Effect of substrate roughness

Vitry

Kanta

Delaunois

2010

Materials Science and Engineering: B

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“…The mechanism of electroless NiB has been studied by many researchers [18,19]. Nevertheless, the mechanism of formation of NiWB remains unclear.…”

Section: Niwb Electroless Platingmentioning

confidence: 99%

Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy

Hamid¹,

Moustafa²,

Morsy³

et al. 2011

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Copper composites reinforced with diamond particles were fabricated by the powder metallurgical technique. Copper matrix and diamond powders were mixed mechanically, cold com- pacted at 100 bar then sintered at 900?C. The prepared powders and sintered copper/diamond composites were investigated using X-ray diffraction (XRD) and scanning electron microscope equipped with an energy dispersive X-ray analysis (SEM/EDS). The effect of diamond contents in the Cu/diamond composite on the different properties of the composite was studied. On fracture surfaces of the Cu/uncoated diamond composites, it was found that there is a very weak bonding between diamonds and pure copper matrix. In order to improve the bonding strength between copper and the reinforcement, diamond particles were electroless coated with NiWB alloy. The results show that coated diamond particles distribute uniformly in copper composite and the interface between diamond particles and Cu matrix is clear and well bonded due to the formation of a thin layer from WB2, Ni3B, and BC2 between Cu and diamond interfaces. The properties of the composites materials using coated powder, such as hardness, transverse rupture strength, thermal conductivity, and coefficient of thermal expansion (CTE) were exhibit greater values than that of the composites using uncoated diamond powder. Additionally, the results reveals that the maximum diamond incorporation was attained at 20 Vf%. Actually, Cu/20 Vf% coated diamond com- posite yields a high thermal conductivity of 430 W/mK along with a low coefficient of thermal expansion (CTE) 6 × 10–6/K

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“…It is well known that annealing could enhance soft magnetic property in some cases [11]. However, for Ni-P coating on Si, many researchers reported that traditional annealing at high temperature may led to the reaction between Ni and Si and bring byproduct NiSi phase, which lead to the decrease of saturation magnetization [12,13]. We studied the effect of holding time during annealing on structure and magnetic properties of Ni-P film and found longer holding time would also bring some impurity phases, such as NiSi phase.…”

Section: Introductionmentioning

confidence: 98%

Effect of rapid magnetic field annealing in vacuum on the structure and magnetic properties of Ni-P films

Yuan

Mao

et al. 2016

Integrated Ferroelectrics

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2016) Effect of rapid magnetic field annealing in vacuum on the structure and magnetic properties of Ni-P films, Integrated Ferroelectrics, 170:1, 33-42, ABSTRACT Ni-P thin films are deposited on silicon wafer by electroless method and treated by different annealing processes. The structure of as-deposited film exhibits the mixture of amorphous and microcrystalline phases, and the M s is 150 emu/cc and H c is 24 Oe. Rapid thermal annealing (RTA) could avoids the impurity and the M s of the sample reached the maximum value about 413 emu/cc after RTA process at 350°C. A magnetic field about 5000 Oe was applied during RTA process, which resulted in higher crystallization temperature, higher value of M s and lower value of H c .

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Electroless deposition of NiWB alloy on p-type Si(100) for NiSi contact metallization

Cited by 15 publications

References 12 publications

Initiation and formation of electroless nickel–boron coatings on mild steel: Effect of substrate roughness

Initiation and formation of electroless nickel–boron coatings on mild steel: Effect of substrate roughness

Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy

Effect of rapid magnetic field annealing in vacuum on the structure and magnetic properties of Ni-P films

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