2019
DOI: 10.1016/j.electacta.2019.02.057
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Electroless deposition of Ni–P and Ni–P–Re alloys from acidic hypophosphite baths

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Cited by 28 publications
(8 citation statements)
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“…We also tested other aqueous electrolyte solutions for NiP autocatalytic deposition on ZnAl powder. Unfortunately, all of the studied NiP plating baths (pH = 5–10, T = 45–90 °C, with the use of various complexing agents [ 72 , 73 , 74 , 75 ]) gave similar results, yielding low-quality NiP deposits on the thick surface oxide layer. SEM-EDS revealed in all cases Ni-based deposits only partially covering the particles, along with thick and brittle oxide layer, often with some cracks and coating delamination.…”
Section: Resultsmentioning
confidence: 97%
“…We also tested other aqueous electrolyte solutions for NiP autocatalytic deposition on ZnAl powder. Unfortunately, all of the studied NiP plating baths (pH = 5–10, T = 45–90 °C, with the use of various complexing agents [ 72 , 73 , 74 , 75 ]) gave similar results, yielding low-quality NiP deposits on the thick surface oxide layer. SEM-EDS revealed in all cases Ni-based deposits only partially covering the particles, along with thick and brittle oxide layer, often with some cracks and coating delamination.…”
Section: Resultsmentioning
confidence: 97%
“…The effects of temperature, pH, sandpaper size and plating time were investigated for the amount of deposit. There a lot of plating baths in the literature [11][12][13]. The composition of the electroless nickel plating bath solution was given in Table 1.…”
Section: Findings and Discussionmentioning
confidence: 99%
“…For example, NiÀ PÀ Re alloys were deposited on a copper substrate at T = 70-100 °C from a bath containing NiSO 4 and NH 4 ReO 4 precursors, hypophosphite as reducing agent and succinate as buffer (pH = 3.0-6.5) and complexing agent. [154] For the same amount of nickel precursor salt introduced in solution, it was shown that the amount of nickel deposited decreased when the amount of rhenium precursor salt was increased. While Ni 0 can only be deposited by reduction of Ni 2 + by hypophosphite, ReO 4 À can be reduced by both hypophosphite and Ni 0 by galvanic replacement, thus explaining the Re 0 deposition at the expense of that of Ni 0 .…”
Section: Other Reducing Agentsmentioning
confidence: 99%
“…While Ni 0 can only be deposited by reduction of Ni 2 + by hypophosphite, ReO 4 À can be reduced by both hypophosphite and Ni 0 by galvanic replacement, thus explaining the Re 0 deposition at the expense of that of Ni 0 . [154] Furthermore, the simultaneous deposition of two metals is complicated by the fact that the precursors may also interact in solution or at the substrate surface, or be reduced at different reaction rates preventing the deposition of alloys with controlled composition. To overcome this difficulty encountered for CuÀ Pt alloys due to the highest reactivity of PtCl 6 2À , a strategy was developed based on the engineering of the ligand shell, and the replacement of chloride ions by ethylenediamine thus decreasing the Pt(IV) reactivity.…”
Section: Other Reducing Agentsmentioning
confidence: 99%
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