Electroless Deposition of Metallic Powders

Djokić, Stojan S.; Djokic, Nada

doi:10.1149/1.3548097

Cited by 27 publications

(23 citation statements)

References 9 publications

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“…In both cases, Ag particles were formed from complex [Ag(NH 3 ) 2 ] + ions. Simultaneously, bulbous particles of Ag are formed via galvanic displacement deposition onto aluminum surface from the ammonium solution [6,19]. On the other hand, Ag dendritic particles are formed by galvanic displacement deposition on germanium substrate from acidic Ag(I) solution at pH 2 [6,20], or in citric acid solution on an aluminum surface [6,19].…”

Section: Discussionmentioning

confidence: 99%

“…[6,[18][19][20][21]. It is necessary to note that most parameters affecting morphology of particles are the same for both electrochemical and chemical processes.…”

Section: Introductionmentioning

confidence: 99%

“…Various silver particles are formed by above mentioned methods for powder production [6,[19][20][21][22][23][24][25]. The interest for investigation of silver structures lies in their unique electrical, chemical, and optical characteristics.…”

Section: Introductionmentioning

confidence: 99%

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Comparative Morphological and Crystallographic Analysis of Electrochemically- and Chemically-Produced Silver Powder Particles

Avramović

Pavlović

Maksimović

et al. 2017

Metals

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Silver powders chemically synthesized by reduction with hydrazine and those produced by electrolysis from the basic (nitrate) and complex (ammonium) electrolytes were examined by X-ray diffraction (XRD) and scanning electron microscopic (SEM) analysis of the produced particles. Morphologies of the obtained particles were very different at the macro level. The needle-like dendrites, as well as the mixture of irregular and regular crystals, were formed from the nitrate electrolyte, while the highly-branched pine-like dendrites with clearly noticeable spherical grains were formed from the ammonium electrolyte. The agglomerates of spherical grains were formed by reduction with hydrazine. In the particles obtained from the nitrate electrolyte, Ag crystallites were strongly oriented in the (111) plane. Although morphologies of Ag particles were very different at the macro level, the similarity at the micro level was observed between chemically-synthesized particles and those obtained by electrolysis from the ammonium electrolyte. Both types of particles were constructed from the spherical grains. This similarity at the micro level was accompanied by the similar XRD patterns, which were very close to the Ag standard with a random orientation of Ag crystallites. For the first time, morphologies of powder particles were correlated with their crystal structure.

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Section: Discussionmentioning

confidence: 99%

“…[6,[18][19][20][21]. It is necessary to note that most parameters affecting morphology of particles are the same for both electrochemical and chemical processes.…”

Section: Introductionmentioning

confidence: 99%

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Comparative Morphological and Crystallographic Analysis of Electrochemically- and Chemically-Produced Silver Powder Particles

Avramović

Pavlović

Maksimović

et al. 2017

Metals

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“…Impurities may significantly affect the rate of many electrochemical reactions 8 including the galvanic displacement. [9][10][11][12] Additionally, the deposits are quite porous as observed for other galvanic displacement processes. 11,12 In this way, the rate of crystal growth is determined by the rate of substrate oxidation (dissolution) which is an anodic process and by the rate of metal ion reduction (deposition) which is a cathodic process.…”

Section: Resultsmentioning

confidence: 77%

Communication—Galvanic Deposition of Gold on Silicon from Au(I) Alkaline Fluoride-Free Solutions

Djokić

Antić

Djokic³

et al. 2016

J. Electrochem. Soc.

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Deposition of gold from alkaline fluoride-free solutions containing Au(I) ions onto silicon surfaces has been demonstrated. This deposition takes place at room temperature and does not require the presence of a reducing agent in the solution. The results clearly show that Au(I) ions can be reduced to Au(0) by silicon and, as a consequence, gold metal can be deposited at the surface of the substrate. © The Author(s) 2016. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any medium, provided the original work is properly cited. [DOI: 10.1149/2.0991614jes] All rights reserved.Manuscript submitted September 28, 2016; revised manuscript received October 31, 2016. Published November 12, 2016 Using aqueous fluoride solutions, successful depositions of copper, silver or gold via the galvanic displacement reaction have been reported. [1][2][3][4] However, the fluorides represent a health hazard and as such are environmentally deleterious. Recent reports showed that silver 5 or copper 6 can be deposited from alkaline fluoride-free solutions directly onto silicon via the galvanic displacement reaction. It was clearly shown that the native SiO 2 films can be removed from the surface of a silicon wafer upon immersion into alkaline fluoride-free solutions. In this way, the direct deposition of silver or copper without a presence of any other reducing agent in the solution is realized via the galvanic displacement reaction. Similarly, this communication describes the observations of the deposition of gold onto silicon wafer from alkaline fluoride-free aqueous solutions containing Au(I) ions. Experimentalp-(B doped) and n-(P doped) single crystal (100) silicon wafers were used as substrates in the present work. As received, silicon substrates were very carefully washed with 3:1 (H 2 SO 4 -H 2 O 2 ) solution and then with water and absolute ethanol. Immersions were performed at pH 14 using a solution containing 30 g/L Na 2 S 2 O 3 and 1 g/L Au 2 S 2 O 3 . The pH of this solution was adjusted with NaOH.The specific immersion times are reported in the Results and discussion section. Experiments were carried out at room temperature (about 23• C). After the immersion, substrates were removed from the solutions and carefully washed with water, ethanol and then pressure dried with air at room temperature. Coated silicon substrates were analyzed by X-ray diffraction (XRD) using the CuKα radiation and by scanning electron microscopy (SEM). Results and DiscussionGold was deposited on both p-and n-Si substrates after immersion into alkaline Au(I) solutions at room temperature for 2 hours. Deposition of gold was observed on both polished and back sides of the silicon wafer. A prolonged exposure of silicon wafers to the investigated solutions obviously leads to the growth of gold particles. In Figure 1 are presented SEM images of the deposited gold onto p-and n-Si s...

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“…The chemical reduction method is often referred to as electroless deposition [15,16]. Various reducing agents, such as ascorbic acid [5,8,16], hydrazine hydrate [7], sodium borohydride [6], and formaldehyde [15], are used in the chemical reduction processes. Copper, in the form of nanoparticles, can be synthesized in ethylene glycol (EG) using copper sulphate as a precursor, and vanadium sulfate as an atypical reductant [17].…”

Section: Introductionmentioning

confidence: 99%

Influence of the Shape of Copper Powder Particles on the Crystal Structure and Some Decisive Characteristics of the Metal Powders

Avramović

Maksimović

Baščarević

et al. 2019

Metals

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Three different forms of Cu powder particles obtained by either galvanostatic electrolysis or a non-electrolytic method were analyzed by a scanning electron microscope (SEM), X-ray diffraction (XRD) and particle size distribution (PSD). Electrolytic procedures were performed under different hydrogen evolution conditions, leading to the formation of either 3D branched dendrites or disperse cauliflower-like particles. The third type of particles were compact agglomerates of the Cu grains, whose structural characteristics indicated that they were formed by a non-electrolytic method. Unlike the sharp tips that characterize the usual form of Cu dendrites, the ends of both the trunk and branches were globules in the formed dendrites, indicating that a novel type of Cu dendrites was formed in this investigation. Although the macro structures of the particles were extremely varied, they had very similar micro structures because they were constructed by spherical grains. The Cu crystallites were randomly oriented in the dendrites and compact agglomerates of the Cu grains, while the disperse cauliflower-like particles showed (220) and (311) preferred orientation. This indicates that the applied current density affects not only the morphology of the particles, but also their crystal structure. The best performance, defined by the largest specific surface area and the smallest particle size, was by the galvanostatically produced powder consisting of disperse cauliflower-like particles.

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Electroless Deposition of Metallic Powders

Cited by 27 publications

References 9 publications

Comparative Morphological and Crystallographic Analysis of Electrochemically- and Chemically-Produced Silver Powder Particles

Comparative Morphological and Crystallographic Analysis of Electrochemically- and Chemically-Produced Silver Powder Particles

Communication—Galvanic Deposition of Gold on Silicon from Au(I) Alkaline Fluoride-Free Solutions

Influence of the Shape of Copper Powder Particles on the Crystal Structure and Some Decisive Characteristics of the Metal Powders

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