2001
DOI: 10.1007/s003960100485
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Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers

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Cited by 49 publications
(29 citation statements)
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“…The most commonly used chemicals include solutions of sodium dichromate (VI), potassium dichromate (VI), and potassium manganate (VII) in diluted sulfuric (VI) acid [1,5,9]. Phenol, sodium hydroxide, sodium hypochlorite, and metallic sodium are being used as well [6].…”
Section: Introductionmentioning
confidence: 99%
“…The most commonly used chemicals include solutions of sodium dichromate (VI), potassium dichromate (VI), and potassium manganate (VII) in diluted sulfuric (VI) acid [1,5,9]. Phenol, sodium hydroxide, sodium hypochlorite, and metallic sodium are being used as well [6].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, several methods have been reported to achieve strong adhesive force between copper film and polyimide with micrometer line and scale without creating micrometer-scale surface roughness. For example, Neoh et al [8][9][10][11][12][13][14] and Inagaki et al [15][16][17][18][19] modified polyimide by graft polymerization of vinylimidazole or vinylpyridine. The plated copper layer interacts with the nitrogen group of the graft polymer, which creates a strong adhesive force between the PI and the copper layer.…”
mentioning
confidence: 99%
“…The vinylpyridine monomer has been identified as an adhesion promoting agent for metal-polymer interfaces due to the strong interaction of the pyridine functional group [21,22]. In the work carried out by Huang et al [8], mentioned above, it is also found that the addition of polystyrene to the blend of PCBM and the low molecular weight donor improves the adhesion.…”
Section: Resultsmentioning
confidence: 99%