Electroless copper plating on nano-silver activated glass substrate: A single-step activation

Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

“…3 displays a plot of the plated copper thicknesses on the silicon substrate as a function of plating time. Copper thickness grows linearly with plating time which is in agreement with the previously published work [19], [20]. A maximal copper thickness of 0.44 ± 0.05 μm was achieved when plated at 30°C with 0.4-M Ag(I) and an increase to Ag NPs concentration also produced thicker copper layers.…”

Characterization of MAO + Cu Composite Coatings on Aluminum Alloy

“…Electroless copper plating is a widely used surface modification treatment technology with a low production cost and a simple process. It can create a non-metallic surface with metallic characteristics and improve the electrical conductivity, thermal conductivity, ductility, and the gloss of the material [7][8][9]. Aluminum electrode potential (−1.67 V) is lower than the potential for the copper electrode (+0.34 V), and copper ions can be reduced to copper, but electroless copper plating is usually carried out in an alkaline environment.…”

Fabricating patterned polyelectrolyte brushes by dynamic microprojection lithography for selective electroless metal deposition

“…As a traditional autocatalytic plating technique, electroless deposition (ELD) has been widely applied to conveniently deposit kinds of metals on the surface of various substrates without external electric current and voltage consume 1–6 . The critical factors for performing a high‐quality ELD process include stable attachment of metallic catalysts (“metal ink”) on the particular area of the substrate surface, and metal ions immobilization to form thin metal film through the autocatalysis reduction reaction in the presence of plating solution containing reducing agents.…”

“…As a traditional autocatalytic plating technique, electroless deposition (ELD) has been widely applied to conveniently deposit kinds of metals on the surface of various substrates without external electric current and voltage consume. [1][2][3][4][5][6] The critical factors for performing a highquality ELD process include stable attachment of metallic catalysts ("metal ink") on the particular area of the substrate surface, and metal ions immobilization to form thin metal film through the autocatalysis reduction reaction in the presence of plating solution containing reducing agents. Tremendous efforts have been devoted to develop high-efficient patterning strategies to realize area-selective metallic catalyst immobilization on the substrate's surface directly, including microcontact printing, [7][8] pen-on-paper writing, [9][10][11] inkjet printing, [12][13] direct laser writing, [14][15][16] microfluidic, [17][18] and so forth.…”