Electroless copper deposition on epoxy glass substrate for electrocatalysis of formaldehyde

Dehchar, Charif; Chikouche, Imene; Kherrat, R.; Sahari, Ali; Zouaoui, Ahmed; Merati, A.

doi:10.1016/j.matlet.2018.06.076

Cited by 20 publications

(8 citation statements)

References 15 publications

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“…The content of free formaldehyde in the control UF adhesive was 0.45%, and it decreased with increasing copper (II) sulfate content. This was due to the oxidation of free formaldehyde by Cu 2+ ions to form formate [ 27 , 28 ]. When 1% copper (II) sulfate was added to UF resin adhesive, the content of free formaldehyde decreased by 55%, surpassing the decrease (50%) achieved with an amine scavenger [ 10 ].…”

Section: Resultsmentioning

confidence: 99%

Effect of Copper (II) Sulfate on the Properties of Urea Formaldehyde Adhesive

Zhao

Wang

et al. 2021

Polymers

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The purpose of this work is to investigate the effects of copper (II) sulfate on formaldehyde release and the mechanical properties of urea formaldehyde (UF) adhesive. Copper (II) sulfate has been used as a formaldehyde scavenger in UF resin, and its effects on the physical and chemical properties of UF adhesive have been studied. Moreover, the mechanical properties and formaldehyde release of plywood prepared with modified UF resin have been determined. The UF resin has been characterized by Fourier-transform infrared (FTIR) spectroscopy and thermogravimetric analysis (TGA). FTIR spectra showed that the addition of copper (II) sulfate to the UF resin did not affect the infrared (IR) absorptions of its functional groups, implying that the structure of UF was not modified. Further results showed that: the free formaldehyde content of the UF resin by the incorporation of 3% copper (II) sulfate was 0.13 wt.%, around 71% lower than that of the control UF adhesive. With a copper (II) sulfate content of 3%, the formaldehyde release from treated plywood was 0.74 mg·L−1, around 50% lower than that from the control UF adhesive, and the bonding strength reached 1.73 MPa, around 43% higher than that of the control UF adhesive.

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Section: Resultsmentioning

confidence: 99%

Effect of Copper (II) Sulfate on the Properties of Urea Formaldehyde Adhesive

Zhao

Wang

et al. 2021

Polymers

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“…The etched PLA samples were then sensitized in SnCl 2 solution for 7 min, activated in PdCl 2 solution for 3 min at room temperature, and then rinsed with DI water. The catalytic Pd atoms formed and served as reactive sites for the electroless deposition reaction to take place, whereby metal ions are reduced to metallic deposits [39].…”

Section: Sample Group A: Chemical Etching and Pd Activationmentioning

confidence: 99%

Strategies for Metallizing and Electroplating Biodegradable PLA

Boonyongmaneerat

Srisupornwichai

Aumnate

et al. 2021

Curr. Appl. Sci. Technol.

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With environmental awareness in societies, bioplastics continue to receive increasing attention and utilization rate. Polylactic acid (PLA) is one of the most important biopolymers in the market today, owing to its high strength and relative ease of forming. Unlike the common structural, fossil fuel-based plastics, such as Acrylonitrile-Butadiene-Styrene (ABS), the surface of PLA cannot be readily metallized in preparation for electroplating using the conventional plating-on-plastic (POP) process. This partially limits the wider use of the material for functional and decorative applications. In this research study, we systematically explored three strategies for metallizing the surface of PLA, namely, (A) chemical etching and palladium activation technique, (B) polyelectrolyte multilayers (PEMs) and Ag nanoparticle deposition technique, and (C) Ag conductive painting technique. PLA samples, prepared by Fused Deposition Modelling (FDM) 3D-printing technique, were metallized by various techniques followed by electroless deposition and electroplating of copper layers. The study was performed comparatively with respect to the ABS surface. The samples microstructures, chemical distributions, and plating characteristics were assessed with optical and scanning electron microscopy. The adhesion of the metallic coatings was analyzed using scratch test and tape test. Although uniform deposition of copper layers on PLA surfaces could be achieved using all three metallizing methods under investigation, the three methods were found to provide different degrees of benefits with respect to deposition rate, surface uniformity, and process simplicity.

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“…Electroless nickel plating on porous alumina ceramics was achieved by Zhang et al [ 17 ]. Dehchar et al successfully deposited copper films on non-conductive epoxy glass substrates by electroless plating as well [ 18 ]. Currently, many works related to electroless nickel plating have been carried out on different ceramic substrates.…”

Section: Introductionmentioning

confidence: 99%

Metallization on Sapphire and Low-Temperature Joining with Metal Substrates

et al. 2022

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To meet the packaging requirements of sapphire in special electronic components, there is an urgent need for a joining process that can realize a good connection between sapphire and dissimilar metals at a low temperature. In this work, the surface of a sapphire substrate was successfully catalytically activated and metallized by an electroless nickel plating process. Moreover, the solderability and interconnection of metallized sapphire with Sn-based solders were evaluated and investigated at 250 °C, and the wetting angle of the Sn-based solders on sapphire on sapphire without and with metallization was 125° and 51°, respectively. The interfacial microscopic morphology and element distribution in the Cu/Sn-Ag solder/sapphire solder joints were analyzed. It was found that the middle solder layer has diffused during the reflow process, inferring good adhesion between sapphire and Cu substrate with the aid of the Ni-P deposition. Thus, a sapphire welding method with a simple process suitable for practical applications is demonstrated.

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Electroless copper deposition on epoxy glass substrate for electrocatalysis of formaldehyde

Cited by 20 publications

References 15 publications

Effect of Copper (II) Sulfate on the Properties of Urea Formaldehyde Adhesive

Effect of Copper (II) Sulfate on the Properties of Urea Formaldehyde Adhesive

Strategies for Metallizing and Electroplating Biodegradable PLA

Metallization on Sapphire and Low-Temperature Joining with Metal Substrates

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