Electroless Co-P diffusion barrier for n-PbTe thermoelectric material

Hsieh, Hsien Chien; Wang, Chun-Hsien; Lin, Wen Chih; Chakroborty, Subhendu; Lee, Tse Hsiao; Chu, Hsu-Shen; Wu, Albert T.

doi:10.1016/j.jallcom.2017.09.051

Cited by 33 publications

(31 citation statements)

References 43 publications

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“…After pretreatment, the substrates were immersed in an 85 °C electroless Co−P plating solution with a pH value of 8.0 for 1 h. The composition of the pretreatment solutions and the plating parameters were adopted from the literature. 18 After plating for 1 h, the thickness of Co−P was ∼3−5 μm, and the amount of P in the film was ∼10 atom %. Solders were reflowed on the n-and p-Bi 2 Te 3 substrates to study the interfacial reactions and to evaluate the stability of the joints in the modules.…”

Section: Methodsmentioning

confidence: 99%

“…The substrates were then dipped into a sensitization and an activation solution. After pretreatment, the substrates were immersed in an 85 °C electroless Co–P plating solution with a pH value of 8.0 for 1 h. The composition of the pretreatment solutions and the plating parameters were adopted from the literature . After plating for 1 h, the thickness of Co–P was ∼3–5 μm, and the amount of P in the film was ∼10 atom %.…”

Section: Methodsmentioning

confidence: 99%

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Interfacial Stability in Bi₂Te₃ Thermoelectric Joints

Wang

Hsieh

Sun

et al. 2020

ACS Appl. Mater. Interfaces

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Bismuth telluride (Bi 2 Te 3 )-based thermoelectric materials are well-known for their high figure-of-merit (zT value) in the low-temperature region. Stable joints in the module are essential for creating a reliable device for long-term applications. This study used electroless Co−P to prevent a severe interfacial reaction between the joints of solder and Bi 2 Te 3 . A thick and brittle SnTe intermetallic compound layer was successfully inhibited. The strength of the joints improved, and the fracture mode became more ductile; furthermore, there was no significant degradation of thermoelectric properties after depositing the Co−P layer after long-term aging. The result suggests that electroless Co−P could enhance the interfacial stability of the joints and be an effective diffusion barrier for Bi 2 Te 3 thermoelectric modules.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Interfacial Stability in Bi₂Te₃ Thermoelectric Joints

Wang

Hsieh

Sun

et al. 2020

ACS Appl. Mater. Interfaces

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“…The most commonly used thermoelectric materials are bismuth telluride (BiTe), lead telluride (PbTe), antimony, germanium, silver telluride (TAGS), lead-tin telluride (PbSnTe) and silicon germanium (SiGe) [20]. All these materials were used in space missions inside RTGs.…”

Section: ④ Thermoelectric Materialsmentioning

confidence: 99%

How does radioisotope thermoelectric generator (RTG) work

Souza¹,

Kim

et al. 2022

Braz. J. Rad. Sci.

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Demand for energy has increasing rapidly in the last decade. In 2021 an increase in 5% was observed. Half of this demand was covered by fossil fuels, increasing CO2 emissions to record levels. With the need for new reliable steady supply sources to be used in places where maintenance is difficult, Radioisotope Thermoelectric Generators (RTG) have been given renewed attention in the past 10 years. RTGs uses radioactive decay to generate electricity. This work presents in a simple manner, the basics of RTG operation, the requirements for construction, and is followed by an example developed at KAERI. Basic Radiation Physics Concepts, RTG configuration requirements, Thermoelectric effect and materials, and calculations for electric power were presented.

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“…Both methods require high operation temperature and may induce severe inter-diffusion. Alternatively, a solid-liquid interdiffusion provides a low-temperature bonding, through the incorporation of low-melting-point interlayers, such as the Sn or In [41][42][43]. Those interlayers (Sn or In) are consumed by the metal layers (such as Ag), resulting in the high-melting-point IMCs (such as Ag 3 Sn and Ag 3 In), which might enhance the bonding strength.…”

Section: Bonding In Pbte-based Modulesmentioning

confidence: 99%

“…PbTe) and the electrodes, to prevent the severe inter-diffusion. Figure 2(a)-(d) interpret the inter-diffusion of n-type PbTe/Cu and n-type PbTe/Ni couples [43], where the diffusion barrier layer (e.g. Co-P) is introduced or not.…”

Section: Bonding In Pbte-based Modulesmentioning

confidence: 99%

Interfacial reactions in thermoelectric modules

Wei

et al. 2018

Materials Research Letters

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Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi 2 Te 3 -based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For midtemperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well. ARTICLE HISTORY

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Electroless Co-P diffusion barrier for n-PbTe thermoelectric material

Cited by 33 publications

References 43 publications

Interfacial Stability in Bi₂Te₃ Thermoelectric Joints

Interfacial Stability in Bi₂Te₃ Thermoelectric Joints

How does radioisotope thermoelectric generator (RTG) work

Interfacial reactions in thermoelectric modules

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Electroless Co-P diffusion barrier for n-PbTe thermoelectric material

Cited by 33 publications

References 43 publications

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Interfacial Stability in Bi2Te3 Thermoelectric Joints

How does radioisotope thermoelectric generator (RTG) work

Interfacial reactions in thermoelectric modules

Contact Info

Product

Resources

About

Interfacial Stability in Bi₂Te₃ Thermoelectric Joints

Interfacial Stability in Bi₂Te₃ Thermoelectric Joints