Electrohydrodynamic‐Printed Polyvinyl Alcohol‐Based Gate Insulators for Organic Integrated Devices

Jung, Cheolmin; Tang, Xiaowu; Kwon, Hyeokjin; Wang, Rixuan; Oh, Sun Moo; Ye, Heqing; Jeong, Yu Rim; Jeong, Yong Jin; Kim, Se Hyun

doi:10.1002/adem.202100900

Cited by 7 publications

(3 citation statements)

References 43 publications

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“…When the electrostatic stresses surpass the surface tension of the meniscus, an extremely narrow stream of droplets is ejected from the Taylor cone with an accuracy better than one-thousandth of the nozzle's orifice, resulting in superior printing resolution (<1 µm). Furthermore, the ink characteristics and process conditions can be tuned in order to create thin film layers via electrospraying [122][123][124]. This level of precision and control makes EHD printing an attractive option for all types of micro-and nano-manufacturing.…”

Section: Advanced Ehd Printing Technologymentioning

confidence: 99%

Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

Wang

Han

et al. 2023

Coatings

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Advanced micro/nano-flexible sensors, displays, electronic skins, and other related devices provide considerable benefits compared to traditional technologies, aiding in the compactness of devices, enhancing energy efficiency, and improving system reliability. The creation of cost-effective, scalable, and high-resolution fabrication techniques for micro/nanostructures built from optoelectronic materials is crucial for downsizing to enhance overall efficiency and boost integration density. The electrohydrodynamic jet (EHD) printing technology is a novel additive manufacturing process that harnesses the power of electricity to create fluid motion, offering unparalleled benefits and a diverse spectrum of potential uses for microelectronic printing in terms of materials, precision, accuracy, and cost-effectiveness. This article summarizes various applications of EHD printing by categorizing them as zero-dimensional (0D), one-dimensional (1D), two-dimensional (2D), and three-dimensional (3D) printing materials. Zero-dimensional (quantum dot) materials are predominantly utilized in LED applications owing to their superb optoelectronic properties, high color fidelity, adjustable color output, and impressive fluorescence quantum yield. One- and two-dimensional materials are primarily employed in FET and sensor technologies due to their distinctive physical structure and exceptional optoelectronic properties. Three-dimensional materials encompass nanometals, nanopolymers, nanoglass, and nanoporous materials, with nanometals and nanopolymers finding widespread application in EHD printing technology. We hope our work will facilitate the development of small-feature-size, large-scale flexible electronic devices via EHD printing.

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Section: Advanced Ehd Printing Technologymentioning

confidence: 99%

Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

Wang

Han

et al. 2023

Coatings

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“…Jung et al fabricated organic field-effect transistors (OFETs) by printing the gate insulating (GI) layer with polyvinyl alcohol (PVA)-based ink. [87] The PVA-based ink was optimized using poly(melamine-co-formaldehyde) (PMF) as a crosslinking agent, and the GI layer was formed through electrohydrodynamic inkjet printing. The effectively cross-linked PVA chain improved the dielectric strength and showed a lower leakage current than the PVA-only dielectric (Figure 4h).…”

Section: Dielectricsmentioning

confidence: 99%

mentioning

confidence: 99%

High‐Resolution 3D Printing for Electronics

et al. 2022

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The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high‐resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D‐printable functional materials and processes for various device components. The latest advances in 3D‐printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next‐generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.

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Eco‐Friendly Approach to Ultra‐Thin Metal Oxides‐ Solution Sheared Aluminum Oxide for Half‐Volt Operation of Organic Field‐Effect Transistors

Dacha,

Haase,

Wrzesińska‐Lashkova

et al. 2024

Adv Funct Materials

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Sol–gel‐based solution‐processed metal oxides have emerged as a key fabrication method for applications in thin film transistors both as a semiconducting and a dielectric layer. Here, a low‐temperature, green solvent‐based, non‐toxic, and cost‐effective solution shearing approach for the fabrication of thin aluminum oxide (AlOx) dielectrics is reported. Optimization of sustainability aspects like energy demand, and selection of chemicals used allows to reduce the environmental impact of the life cycle of the resulting product already in the design phase. Using this approach, ultra‐thin, device‐grade AlOx films of 7 nm are coated—the thinnest films to be reported for any solution‐fabrication method. The metal oxide formation is achieved by both thermal annealing and deep ultra‐violet (UV) light exposure techniques, resulting in capacitances of 750 and 600 nF cm−2, respectively. The structural analysis using microscopy and x‐ray spectroscopy techniques confirmed the formation of smooth, ultra‐thin AlOx films. These thin films are employed in organic field‐effect transistors (OFETs) resulting in stable, low hysteresis devices leading to high mobilities (6.1 ± 0.9 cm2 V−1 s−1), near zero threshold voltage (−0.14 ± 0.07 V) and a low subthreshold swing (96 ± 16 mV dec−1), enabling device operation at only ±0.5 V with a good Ion/Ioff ratio (3.7 × 105).

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Electrohydrodynamic‐Printed Polyvinyl Alcohol‐Based Gate Insulators for Organic Integrated Devices

Cited by 7 publications

References 43 publications

Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

High‐Resolution 3D Printing for Electronics

Eco‐Friendly Approach to Ultra‐Thin Metal Oxides‐ Solution Sheared Aluminum Oxide for Half‐Volt Operation of Organic Field‐Effect Transistors

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