Electroforming of copper by the periodic reversal process

Sankar, P. Ram; Khattak, B. Q.; Jain, Achal; Kaul, R.; Ganesh, P.; Nath, Ashish Kumar; Tiwari, P.; Amban, A.; Pagare, Atharva

doi:10.1179/174329405x50028

Cited by 8 publications

(2 citation statements)

References 3 publications

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“…Despite the advantages noted earlier, mask electrodeposition also has some limitations [22]. In the mask electrodeposition process, photographic lm is usually used to constrain the electric eld, but the electric eld lines tend to gather at the edges of the hollow cavity and are distributed unevenly within it [23]. As a result, the metal deposition rate at the edge of the cavities is higher than that in their middle regions, resulting in uneven microstructure thickness machining and a "saddle" shape at the top of the cast layer section [24], and the surface quality of a single electrodeposited metal microstructure is poor.…”

Section: Introductionmentioning

confidence: 99%

A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

Zhang

Deng

et al. 2022

Int J Adv Manuf Technol

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In this paper, a novel mask electrochemical additive and subtractive combined manufacturing technique was proposed. This is a machining method at the atomic level, and it can be used to produce metal microstructures with high pro le accuracy and low surface roughness. Due to the accumulation of electric eld lines during mask electrochemical deposition, the height of the edges of the microcolumns is usually twice or more the height of the central position in the deposition plane. A combined machining method based on the electric-eld constraint of the mask is thus proposed to improve the accuracy of the pro le and its surface roughness. The feasibility of the proposed method was veri ed by both simulations and experiment. The height difference between the column center and the surrounding layer on the surface of nickel microcolumns was reduced from 13 to 2 µm, and the roughness of the tops of the microcolumns was also improved. Experiments to examine electrolysis leveling were carried out to verify the correctness of the results of the simulations and theoretical calculations. Finally, the parameters were optimized using orthogonal experiments, and an array of nickel microcolumns with a diameter of 200 µm and a height of nearly 50 µm was obtained using these optimal parameters. The pro le accuracy and surface roughness of the high-precision microcolumn array were improved by using the mask electrochemical additive and subtractive combined machining technique, and a high-precision microcolumn array structure was manufactured.

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Section: Introductionmentioning

confidence: 99%

A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

Zhang

Deng

et al. 2022

Int J Adv Manuf Technol

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show abstract

“…It is well known technique which starts with a stainless steel plate. The plate is then mechanically polished, chemically cleaned and is passivated in sodium chromate-nitric acid solution to facilitate easy removal of deposit from the plate [20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Modification of a Substrate Roughness for a Fabrication of Freestanding Electroplated Metallic Microstructures

Pimpin

Srituravanich

2017

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Abstract.This study aims to demonstrate a simple fabrication technique of freestanding electroplated metallic microstructures by modifying a substrate roughness. The proposed technique utilizes counter effects between two forces, i.e. an intrinsic force causing shrinkage in an electroplated metallic microstructure, and an adhesive force adhering a metallic microstructure to a substrate. With the modification of substrate roughness until the adhesive force becomes weaker than the induced intrinsic force, electroplated metallic microstructures would spontaneously release from the substrate after the electroplating process. Three parameters, i.e. substrate roughness, electroplated square structure's area and electroplated rectangular structure's width-to-length ratio, were experimentally studied. The results showed that the electroplated structure with a smaller size and smaller width-to-length ratio was more easily detached from the substrate for a given substrate roughness. In addition, for the same electroplated structure, a substrate with less roughness allowed a detachment of electroplated microstructure more easily.

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Electroforming of revolving parts with near-polished surface and uniform thickness

Zhu

et al. 2007

Int J Adv Manuf Technol

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Electroforming of copper by the periodic reversal process

Cited by 8 publications

References 3 publications

A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

Modification of a Substrate Roughness for a Fabrication of Freestanding Electroplated Metallic Microstructures

Electroforming of revolving parts with near-polished surface and uniform thickness

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