2010
DOI: 10.1016/j.jpowsour.2010.02.055
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Electrodeposition of yttria/cobalt oxide and yttria/gold coatings onto ferritic stainless steel for SOFC interconnects

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Cited by 34 publications
(20 citation statements)
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References 34 publications
(42 reference statements)
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“…[12] To minimize these disadvantages various protective coatings, acting as barriers for oxidation and/or Cr diffusion, have been tested. [8,[13][14][15] However, Cr poisoning still remains a serious obstacle because of limited physico-chemical insights into the behaviour of the interconnects as a part of the complex multi-material system under working conditions.…”
Section: Introductionmentioning
confidence: 99%
“…[12] To minimize these disadvantages various protective coatings, acting as barriers for oxidation and/or Cr diffusion, have been tested. [8,[13][14][15] However, Cr poisoning still remains a serious obstacle because of limited physico-chemical insights into the behaviour of the interconnects as a part of the complex multi-material system under working conditions.…”
Section: Introductionmentioning
confidence: 99%
“…Apart from Cr contamination, that is typical for systems employing ferritic stainless steel interconnects [2][3][4][5][6][7][8], two key mechanisms have been considered: (i) electrode delamination and (ii) cation migration and/or segregation of passivating species [9][10][11][12][13][14][15]. Delamination of the oxygen electrode seems to be due to the presence of large oxygen activity gradients that causes the formation of gaseous oxygen within the electrolyte close to the electrode/electrolyte interface, resulting in generation of nanoporosity at the grain boundaries.…”
Section: Introductionmentioning
confidence: 99%
“…It is this component that lets connect the single SOFCs (individual cells) forming stacks (Figures 1(a) and 1(b)). In the last years, there is a greater tendency to develop the planar configuration for SOFC systems, and this type of configuration is capable of achieving very high power density [8,9], characterized by a very thin Electrolyte-Electrodes Assembly (EEA) deposited on an interconnect considerably thicker, but that presents a zone for gas feeding (Figure 1(c)) [6,9]. Another interconnector closes the device and this set constitutes the repeating unit which is forming the stack.…”
Section: Introductionmentioning
confidence: 99%
“…With the possibility of reducing the operating temperature of 900 0 C-1,000 0 C (HT-SOFC, high temperature SOFC) to 650 0 C-800 0 C (IT-SOFC, intermediate temperature SOFC) due to development of new materials and constructive refinements of the device that allowed the employment electrolyte reduced thicknesses, which do not require temperatures as high as those of the firstgeneration of SOFC, it became possible to use metal interconnects to replace the purely bulk ceramic interconnects based on lanthanum chromites, the which can represent significant gains in manufacturing (via simplification of procedures) and operating performance of SOFC [7,8,10]. Thus, in recent years, ferritic stainless steels (FSS) have been intensively considered for this application [5,[8][9][10][11][12]. However, about 800 0 C, FSS have problems caused by volatilization of Cr contained therein and the overgrowth of chromium oxide (Cr2O3) layer, with high electrical resistivity, which tends to increase the electrical contact resistance (ECR) between the interconnector and the SOFC electrodes, causing loss of performance and promoting the degradation of the device.…”
Section: Introductionmentioning
confidence: 99%