2024
DOI: 10.1016/j.electacta.2023.143694
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Electrodeposition of stress-relaxation-induced (111)-oriented nanotwin copper film by direct current in additive-free electrolyte

Haneul Han,
Jinmyeong Seo,
Youjung Kim
et al.
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Cited by 2 publications
(1 citation statement)
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“…In industrial applications, direct current (DC) electrodeposition is preferred over pulse current (PC) due to advantages such as lower complexity, reduced equipment costs, shorter plating times, and higher efficiency [4]. Copper coatings and their intermetallic composites are utilized in various applications, including electrocatalysts, anode current collectors, and chip interconnections [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…In industrial applications, direct current (DC) electrodeposition is preferred over pulse current (PC) due to advantages such as lower complexity, reduced equipment costs, shorter plating times, and higher efficiency [4]. Copper coatings and their intermetallic composites are utilized in various applications, including electrocatalysts, anode current collectors, and chip interconnections [5,6].…”
Section: Introductionmentioning
confidence: 99%