Electrodeposition of Sn–Zn and Sn–Zn–Mo layers from citrate solutions

Kazimierczak, Honorata; Ozga, P.

doi:10.1016/j.susc.2012.08.010

Cited by 43 publications

(14 citation statements)

References 13 publications

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“…Citrates also provide the stabilization of the pH of electrolyte solutions, hence they are widely used in the electrodeposition of zinc and its alloys [55,56]. The electrolyte composition in this work was selected based on earlier studies of the electrodeposition of zinc-based alloys from aqueous citrate solutions [53,54,[56][57][58][59]. The only variable in the bath chemistry was the type of organic additive ( Figure 1).…”

Section: Resultsmentioning

confidence: 99%

The Effect of Direct and Pulsed Current in the Presence of Surfactants on the Electrodeposition of Zn–SiC Nanocomposite Coatings

et al. 2019

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Zn–SiC nanocomposite coatings were electrodeposited from aqueous citrate electrolytes using either direct current deposition (DCD) or pulsed electrodeposition (PED). The effects of various surface-active organic compounds (SDS, gum arabic, gelatin, CTAB, PEG 20000, and Triton X–100) on the coatings’ surface morphology and chemical composition were studied. The influence of pulse frequency and duty cycle on the percentage of the SiC nanoparticles (NPs) incorporated and on the quality of the deposits was also investigated. The amount of SiC NPs incorporated in the Zn matrix was similar for layers obtained by DCD compared to PED. The Zn–SiC coating deposited by PED exhibited a more fine-grained surface morphology. The percentage of SiC co-deposited with Zn was mainly affected by the type of surfactant used. The ionic surfactants (cationic gelatin and CTAB or anionic gum arabic) allowed the co-deposition of considerably higher amounts of SiC NPs with Zn, compared to the non-ionic compounds PEG 20000 and Triton X–100. However, the use of high molecular weight organic compounds such as gelatin and gum arabic led to aggregation of SiC NPs within the Zn matrix.

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Section: Resultsmentioning

confidence: 99%

The Effect of Direct and Pulsed Current in the Presence of Surfactants on the Electrodeposition of Zn–SiC Nanocomposite Coatings

et al. 2019

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“…Normally, electrodeposition of Zn-Sn alloys is achieved from aqueous solution [5,[12][13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Effects of additives on the electrodeposition of Zn Sn alloys from choline chloride/ethylene glycol-based deep eutectic solvent

Alesary

Ismail

Shiltagh

et al. 2020

Journal of Electroanalytical Chemistry

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“…Andrew et al revealed that Sn and Zn can be electrodeposited individually and as alloys from an electrolytic solution containing choline chloride and ethylene glycol or urea [14]. In addition, the electrodeposition of Sn-Zn alloys from an aqueous solution containing tartaric acid [15,16], citric acid [17][18][19], gluconic acid [20][21][22] and from an alkaline aqueous solution [23] has been investigated. While these research works revealed that Sn-Zn alloys can be electrodeposited from several types of electrolytic solutions, there are no reports on the solderability of electrodeposited Sn-Zn alloys.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

Tsurusaki

Ohgai

2020

Materials

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Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 °C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca. 40 MPa and 12%, respectively.

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Electrodeposition of Sn–Zn and Sn–Zn–Mo layers from citrate solutions

Cited by 43 publications

References 13 publications

The Effect of Direct and Pulsed Current in the Presence of Surfactants on the Electrodeposition of Zn–SiC Nanocomposite Coatings

The Effect of Direct and Pulsed Current in the Presence of Surfactants on the Electrodeposition of Zn–SiC Nanocomposite Coatings

Effects of additives on the electrodeposition of Zn Sn alloys from choline chloride/ethylene glycol-based deep eutectic solvent

Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

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