Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Anicăi, Liana; Petica, Aurora; Costovici, Stefania; Moïse, C.; Brîncoveanu, Oana; Visan, Teodor

doi:10.3390/coatings9120800

Cited by 9 publications

(2 citation statements)

References 41 publications

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“…Environmental and health concerns prompted the elimination of SnPb solder from all electronic applications in so many countries. In this environment, the interest in developing lead-free solder alloys has grown [6,7]. Leadfree solders such as Sn-58Bi, Sn-52In and Sn-3.5Ag might be used to replace Sn-37Pb solder in low-cost electronic assembly [8].…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Al-Hammadi,

Loqman,

AL-Hdhrami

2023

jast

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Research on Material Science has a long tradition, and lead has been used widely in many applications. Because of their low melting temperatures, low cost, and good wettability, tin -lead alloys have been preferred as solder alloys in industrial production, particularly in the electronics sector. However, due to the negative effects of lead on the environment and human health, studies on lead-free solder alloys have been increasing, and the subject is still important today. Furthermore, environmental protection agencies (RoHS and WEEE) have prohibited the use of lead-containing solder alloys in the manufacture of electronic and microelectronic products. In this work, the effect of adding Cu to alloys in five compositions of (81Sn-xCu-(19-x)In) % with x=1, 2, 3, 4, and 5 on the mechanical properties has been studied. The five samples were prepared from high purity (99%) elements (Sn –Cu –In ) using the melting technique. The creep of the ternary alloys was examined at different temperatures (25, 50, and 80 ) under three different loads (2.5, 6.3, and 11.4 MPa). It was found that the creep rate of the ternary alloys was increasing with the increases in Cu –content in all samples at different temperatures and loads. The mean values of the stress exponent were found to be in the range of (0.1-2.5) as well as the activation energies vaied in the range of (0.48-5.33) eV for all alloys under different loads (2.5, 6.3, and 11.4 MPa).

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Section: Introductionmentioning

confidence: 99%

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Al-Hammadi,

Loqman,

AL-Hdhrami

2023

jast

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“…It was proved that the addition of In could lead to the removal of whiskers growth in Sn electrodeposition, presenting a better behaviour compared to lead (Das Mahapatra et al 2017; Das Mahapatra and Dutta 2018;Meinshausen et al 2016). In addition to being used as lead-free, Sn-In alloys are also used as protective and wear-resistant coatings(Kim et al 2018;Lai, Yang, and Yuan 2017) Anicai et al (2019). presented several experimental results regarding Sn-In alloy electrodeposition using DES as electrolyte with ethylene glycol as HBD.…”

mentioning

confidence: 99%

Nanostructured Tin-based Alloys Composites using Deep Eutectic Solvents as Electrolytes

Brandão

Costa

Silva

et al. 2020

UPjeng

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Metal and alloys electrodeposition from aqueous electrolytes is restricted due to the narrow electrochemical window and hydrogen evolution. To overcome these disadvantages, over the past years, ionic liquids (ILs) and deep eutectic solvents (DES) based on choline chloride have been successfully applied for the electrodeposition of different metals.Tin (Sn) layers applied to automotive or decorative plating are thought of as ecological alternatives to exchange lead and nickel/chromium coatings. Over the past few years, the attention drawn by metallic alloys and composites, namely Sn alloys (nickel, indium, copper, zinc…) and Sn-carbon materials composites, has increased due to the possibility of applying these materials as anodes for lithium-ion batteries.This review will highlight the leading research regarding the electrodeposition of Sn and several alloys and carbon composites, emphasizing the morphological changes of the alloy combinations using DESs as electrolytes.

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Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

Qin

Zhang³

et al. 2021

J Mater Sci: Mater Electron

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Electrodeposition of Sn–In Alloys Involving Deep Eutectic Solvents

Cited by 9 publications

References 41 publications

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Mechanical Properties of the (81Sn–xCu–(19-x) In) % Alloys with x=1, 2, 3, 4, and 5

Nanostructured Tin-based Alloys Composites using Deep Eutectic Solvents as Electrolytes

Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy

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