Electrodeposition of Paramagnetic Copper Film under Magnetic Field on Paramagnetic Aluminum Alloy Substrates

Abstract

Electrodeposition of paramagnetic copper (Cu) from a sulfate solution was investigated under magnetic fields and two different current densities. Static magnetic fields have been used during electrodeposition of paramagnetic Cu onto paramagnetic aluminum (Al) substrate to enhance the deposition rate and to alter crystallographic orientation and morphology of the film. The magnetic field might be attributed to the field-induced convection that disrupts the depletion layer near the electrode and that might also be correlated to Cu, Al, and oxygen dissolved in the solution as paramagnetic materials. An X-ray diffractometry, a scanning electron microscope with energy dispersive spectrometry, a potentiostat, and a digital camera were used for characterizing the crystal structure, morphology, the electrochemical behavior, and wettability, respectively. The results show that, at the current density of 10 mA cm −2 , raising the magnetic field from 800 to 1400 G increases the cathode current efficiency and alters the electrochemical behavior, the crystal growth, and the crystallite size. At the current density of 30 mA cm −2 , the magnetic field alters the growth and crystallographic orientation. The static magnetic field exposed during electrodeposition of Cu onto the Al alloy can control the film properties, especially crystallographic orientation and the oxygen content.

Magnetic field exposure on electroplating process of ferromagnetic nickel ion on copper substrate

“…the deposition rates were converted after measurement to nm min -1 . The current efficiency was measured by the following equation [3]:…”

“…However, the electroplating method has many advantages, such as being easy to operate, relatively cheap, and easy to control [1]. In the electroplating process, many conditions are carried out to reach the desired properties such as variations in electrolyte solution, and the addition of magnetic fields [2][3]. The magnetic field effect on the electrodeposition process may be due to its influence on mass transport, reaction kinetics, or ion deposition.…”

Effect of low magnetic field during nickel electroplating on morphology, structure, and hardness

“…Another possible force-induced cathodic current efficiency and deposition rate is a magnetic gradient force (𝑭 𝛻𝐵 ). Magnetic gradient force acts on paramagnetic and diamagnetic ions and commonly formed in electrolyte containing Ni 2+ ions [10]. Convection flow has enhanced the speed of the Ni 2+ ion direction from the anode to the cathode, promoted to an increase in deposition rate and cathodic current efficiency electroplating of Ni [8].…”

“…A magnetic gradient force (𝑭 𝛻𝐵 ) is another possible force. Magnetic gradient force acts on paramagnetic and diamagnetic ions [10].…”

Electrochemical deposition of cobalt-nickel coatings in a constant magnetic field

“…Development of functional metallic and metal alloy coatings with the specific mechanical, electrical, and magnetic properties is one of the main directions of research in electrochemistry (Kołodziejczyk et al, 2018;Louki et al 2021;Mieszkowska et al, 2021;Mishra et al, 2020;Shapouri et al 2021;Soegijono et al, 2020). Among them, Co-Ni alloys coatings are of special interest as they display such favorable features as high coercive forces, very low residual stresses and high surface abrasion resistance (Sinha et al, 1990).…”