Electrodeposition of Ni–P Alloys From a Sulfamate Electrolyte

Abstract

This study describes the effects of the electrolyte pH on phosphorus content, microstructures, and internal stress of NiP deposits prepared from a sulfamate bath containing phosphorous acid. Decreasing the pH increases the concentration of nondissociated phosphorous acid in the electrolyte, which results in a monotonic increase of the phosphorus content in the deposits. The increase in phosphorus content decreases the grain size but increases the strength of the ͑111͒ texture. Decreasing the pH to about 1.5 can decrease the internal stress dramatically to values close to that of the pure Ni deposited at the same pH. A consistent mechanism of the internal stress evolution in both pure Ni and NiP deposits associated with varying the pH is proposed.

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

“…The pH of the bath is another important factor for the P content of the films. It was found that decreasing the pH leads to a notable decrease in the internal stress of the coatings [160].…”

Dépôt chimique de nickel : synthèse bibliographique

“…A température donnée, l'énergie d'activation du dépôt enregistre une augmentation lorsque le pH diminue. Récemment, Chang et al [29]o n tétudié l'influence du pH des bains d'électrodéposition sur les caractéristiques structurales des dépôts nickel-phosphore. L'augmentation du pourcentage massique en phosphore atomique dans le dépôt avec la diminution du pH est mise enévidence.…”

Ni-P-TiO2 nanocomposite coatings with uniformly dispersed Ni3Ti intermetallics: effects of TiO2 nanoparticles concentration

“…Owing to their high hardness and appropriate resistance to both wear and corrosion, electrodeposited Ni-P alloy matrix composite coatings can be considered as an suitable candidate for replacing the pure nickel coatings which commonly used to protect the copper moulds in the continuous casting of steels. Furthermore, it can be satisfactorily electrodeposited on the copper substrates used for mould insert in microinjection moulding process [14]. Various ceramic and polymer reinforcements can be incorporated into the Ni-P alloy matrix to enhance its mechanical, tribological, and corrosion-related properties [15,16].…”